共 15 条
[2]
Suppression of the parallel-plate noise in high-speed circuits using a metallic electromagnetic band-gap structure
[J].
2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3,
2002,
:493-496
[3]
*AG, ADV DES SYST
[4]
*ANS, SIWAVE 2 0
[5]
ansoft, High Frequency Structure Simulator (HFSS)
[6]
CHEN G, 2004, P 13 TOP M EL PERF E, P207
[7]
CHEN G, 2003, P ECTC, P1413
[9]
Lau JH, 1998, ELECT PACKAGING DESI
[10]
MODELING AND ANALYSIS OF MULTICHIP-MODULE POWER-SUPPLY PLANES
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING,
1995, 18 (04)
:628-639