共 16 条
[1]
Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2003, 26 (01)
:206-214
[2]
Carslaw H.S., 1993, CONDUCTION HEAT SOLI
[4]
Crank J., 1956, MATH DIFFUSION, P2
[5]
Fretz M., 2007, COMSOL US C 2007 GRE
[8]
Ma Xiong, 2006, Chin J Dig Dis, V7, P7, DOI 10.1111/j.1443-9573.2006.00237.x
[9]
Ming-Han Tsai, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009), P1002, DOI 10.1109/ICEPT.2009.5270573
[10]
Ozisik MN., 1980, HEAT CONDUCTION