Grain boundary doping strengthens nanocrystalline copper alloys

被引：81
作者：
Ozerinc, Sezer [1 ]
Tai, Kaiping [2 ]
Vo, Nhon Q. [2 ]
Bellon, Pascal [2 ]
Averback, Robert S. [2 ]
King, William P. [1 ,2 ]
机构：
[1] Univ Illinois, Dept Mech Sci & Engn, Urbana, IL 61801 USA
[2] Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA
来源：
SCRIPTA MATERIALIA | 2012年 / 67卷 / 7-8期
关键词：
Grain boundary strengthening; Nanocrystalline metal; Nanoindentation; Nanohardness; Grain boundary energy; STRAIN-RATE SENSITIVITY; HALL-PETCH RELATIONSHIP; PLASTIC-DEFORMATION; MECHANICAL-BEHAVIOR; CU; METALS; FILMS; EVOLUTION; TWINS; MICROSTRUCTURE;
D O I：
10.1016/j.scriptamat.2012.06.031
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Nanoindentation hardness measurements were performed on nanocrystalline (nc-) Cu alloys to test recent molecular dynamics predictions that (i) solute segregation to grain boundaries can lead to significant strengthening and (ii) solutes with large size mismatch with Cu are most effective. Results show that the hardness of nc-Cu90Nb10 is greater than 5 GPa, more than double that of pure nc-Cu, whereas similar additions of Fe solute have nearly no effect. These results are in good agreement with simulations. (c) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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收藏
页码：720 / 723
页数：4
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