Flex Tape Ball Grid Array

被引：0

作者：

Karnezos, M ^{[1
]}

Goetz, M ^{[1
]}

Dong, F ^{[1
]}

Ciaschi, A ^{[1
]}

Chidambaram, N ^{[1
]}

机构：

[1] ASAT INC,PALO ALTO,CA 94303

来源：

46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS | 1996年

关键词：

D O I：

10.1109/ECTC.1996.550898

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Flex Tape Ball Grid Array (FTBGA) is a family of cavity down BGAs. The die, the flex tape and the solder balls are attached to the bottom side of a metallic heatspreader that acts as the stiffener and carrier of the package. The die is wire bonded to the tape traces and then encapsulated. The thermal and electrical performance and reliability are clearly superior to the alternative Plastic Ball Grid Arrays (PBGAs), the conventional plastic and thermally enhanced QFPs. The packages are constructed from materials that are well established in the industry. They are assembled using the same equipment, tools and processes as for the assembly of PBGAs.

引用

页码：1271 / 1277

页数：3