Optimization of AlGaN/GaN HEMTs for high frequency operation

被引:30
|
作者
Palacios, T [1 ]
Dora, Y [1 ]
Chakraborty, A [1 ]
Sanabria, C [1 ]
Keller, S [1 ]
DenBaars, SP [1 ]
Mishra, UK [1 ]
机构
[1] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
来源
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE | 2006年 / 203卷 / 07期
关键词
D O I
10.1002/pssa.200565384
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper, the structure and processing of AlGaN/GaN high electron mobility transistors have been optimized for maximum small signal gain at high frequencies. The effect of the gate resistance, gate-to-drain capacitance and output conductance on the power gain cut-off frequency,f(max), of the devices has been experimentally studied. The reduction of the gate width allowed a 4-fold decrease in gate resistance which resulted in almost a 100% increase influx. To minimize C-gd, F-shape gates have been processed instead of the conventional T-shape submicron gates. Finally, to reduce the output conductance, the confinement of the 2-dimensional electron gas was increased by using an ultra-thin InGaN layer below the GaN channel. This InGaN back-barrier caused a 2-fold improvement in output conductance which allowed a 20% increase in f(max). By optimizing all these parameters, AlGaN/GaN transistors with a record f(max) of 230 GHz were obtained. (c) 2006 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
引用
收藏
页码:1845 / 1850
页数:6
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