110-GHz Through-Substrate-Via Transition Based on Copper Nanowires in Alumina Membrane

被引：15

作者：

Pinheiro, Julio M. ^{[1
]}

Rehder, Gustavo P. ^{[1
]}

Gomes, Leonardo G. ^{[1
]}

Alvarenga, Rogerio C. A. ^{[1
]}

Pelegrini, Marcus V. ^{[1
]}

Podevin, Florence ^{[2
,3
]}

Ferrari, Philippe ^{[2
,3
]}

Serrano, Ariana L. C. ^{[1
]}

机构：

[1] Univ Sao Paulo, Lab Microelect, BR-05508900 Sao Paulo, Brazil

[2] Univ Grenobles Alpes, IMEP LAHC, F-380010 Grenoble, France

[3] CNRS, IMEP LAHC, F-38000 Grenoble, France

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2018年 / 66卷 / 02期

基金：

巴西圣保罗研究基金会;

关键词：

High-density via; millimeter-wave (mmW) technology; nanowires; 3-D interconnection; through-substrate via (TSV); FABRICATION; PACKAGE;

D O I：

10.1109/TMTT.2017.2763142

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new through-substrate via (TSV) for millimeter-wave frequencies is proposed. The via is formed by copper nanowires connecting the bottom and top surfaces of a porous alumina membrane. It is shown here that the nanowire via is simple to fabricate using a low-cost technology. The nanowire vias were tested as coplanar waveguide transitions and characterized up to 110 GHz. The results show insertion loss better than 0.37 dB and return loss better than 14 dB per transition at 110 GHz. An electrical model for the vias was derived to give a design tool for circuit designers. These TSVs, along with the high-performance transmission lines already developed on the porous alumina membranes, contribute to a powerful platform for the design of high-performance circuits on this innovative interposer.

引用

页码：784 / 790

页数：7

共 21 条

[1] [Anonymous], P IMAPS
[2] [Anonymous], P IEEE EL COMP TECHN
[3] [Anonymous], 2013, P IEEE INT 3D SYSTEM
[4] [Anonymous], IEDM
[5] [Anonymous], P IEEE EL COMP TECHN
[6] Banijamali B, 2013, 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), P35, DOI 10.1109/ECTC.2013.6575547
[7] High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires
Bleiker, Simon J.
Fischer, Andreas C.
Shah, Umer
Somjit, Nutapong
Haraldsson, Tommy
Roxhed, Niclas
Oberhammer, Joachim
Stemme, Goran
Niklaus, Frank
[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2015, 5 (01): : 21 - 27
[8] Modeling, Fabrication, and Characterization of Low-Cost and High-Performance Polycrystalline Panel-Based Silicon Interposer With Through Vias and Redistribution Layers
Chen, Qiao
Suzuki, Yuya
Kumar, Gokul
Sundaram, Venky
Tummala, Rao R.
[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2014, 4 (12): : 2035 - 2041
[9] 60-110 GHz low loss HDI transitions for LCP-packaged silicon substrate
Chung, D. J.
Papapolymerou, J.
[J]. ELECTRONICS LETTERS, 2010, 46 (08) : 577 - U52
[10] Low Loss Multilayer Transitions using Via Technology on LCP from DC to 40 GHz
Chung, David J.
Bhattacharya, Swapan K.
Papapolymerou, John
[J]. 2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 2025 - 2029

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