Effect of graphene nanosheets reinforcement on the performance of Sn-Ag-Cu lead-free solder

被引：142
作者：
Liu, X. D. [1 ,2 ]
Han, Y. D. [1 ,2 ]
Jing, H. Y. [1 ,2 ]
Wei, J. [3 ]
Xu, L. Y. [1 ,2 ]
机构：
[1] Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300072, Peoples R China
[2] Tianjin Key Lab Adv Joining Technol, Tianjin 300072, Peoples R China
[3] Singapore Inst Mfg Technol, Singapore 638075, Singapore
来源：
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2013年 / 562卷
基金：
高等学校博士学科点专项科研基金; 中国国家自然科学基金;
关键词：
Graphene nanosheets (GNSs); Lead-free solder; Thermal expansion; Mechanical properties; COATED CARBON NANOTUBES; MATRIX COMPOSITES; TEMPERATURE; STABILITY; ALLOYS;
D O I：
10.1016/j.msea.2012.10.079
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Varying weight fractions of graphene nanosheets were successfully incorporated into lead-free solder using the powder metallurgy route. The effects of graphene nanosheets on the physical, thermal, and mechanical properties of a Sn-Ag-Cu solder alloy were investigated. With the increasing addition of graphene nanosheets, the nanocomposite solders showed a corresponding improvement in their wetting property but an insignificant change in their melting point. The thermomechanical analysis showed that the presence of graphene nanosheets can effectively decrease the coefficient of thermal expansion (CTE) of the nanocomposites. Furthermore, an improvement in UTS and a decrease in ductility were recorded with the addition of graphene nanosheets. The reinforcing mechanism of the graphene nanosheets on various properties obtained was also analyzed in this study. (C) 2012 Elsevier B.V. All rights reserved.
引用
收藏
页码：25 / 32
页数：8
相关论文
共 34 条
[1]   Lead-free solders in microelectronics [J].
Abtew, M ;
Selvaduray, G .
MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2000, 27 (5-6) :95-141
[2]   Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications [J].
Anderson, Iver E. .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) :55-76
[3]   Sum frequency generation study on the orientation of room-temperature ionic liquid at the graphene-ionic liquid interface [J].
Baldelli, Steven ;
Bao, Jiming ;
Wu, Wei ;
Pei, Shin-shem .
CHEMICAL PHYSICS LETTERS, 2011, 516 (4-6) :171-173
[4]   Graphene-aluminum nanocomposites [J].
Bartolucci, Stephen F. ;
Paras, Joseph ;
Rafiee, Mohammad A. ;
Rafiee, Javad ;
Lee, Sabrina ;
Kapoor, Deepak ;
Koratkar, Nikhil .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2011, 528 (27) :7933-7937
[5]   A route to high surface area, porosity and inclusion of large molecules in crystals [J].
Chae, HK ;
Siberio-Pérez, DY ;
Kim, J ;
Go, Y ;
Eddaoudi, M ;
Matzger, AJ ;
O'Keeffe, M ;
Yaghi, OM .
NATURE, 2004, 427 (6974) :523-527
[6]   Phase diagrams of Pb-free solders and their related materials systems [J].
Chen, Sinn-Wen ;
Wang, Chao-Hong ;
Lin, Shih-Kang ;
Chiu, Chen-Nan .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) :19-37
[7]   THERMODYNAMIC THEORY OF SIZE DEPENDENCE OF MELTING TEMPERATURE IN METALS [J].
COUCHMAN, PR ;
JESSER, WA .
NATURE, 1977, 269 (5628) :481-483
[8]   One- and two-dimensional diffusion of metal atoms in graphene [J].
Gan, Yanjie ;
Sun, Litao ;
Banhart, Florian .
SMALL, 2008, 4 (05) :587-591
[9]   The rise of graphene [J].
Geim, A. K. ;
Novoselov, K. S. .
NATURE MATERIALS, 2007, 6 (03) :183-191
[10]   Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes [J].
Han, Y. D. ;
Jing, H. Y. ;
Nai, S. M. L. ;
Xu, L. Y. ;
Tan, C. M. ;
Wei, J. .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2012, 23 (05) :1108-1115
1234