To investigate interface shape and thermal stress during sapphire single crystal growth by the Cz method

被引:37
作者
Fang, H. S. [1 ]
Pan, Y. Y. [1 ]
Zheng, L. L. [2 ]
Zhang, Q. J. [1 ]
Wang, S. [1 ]
Jin, Z. L. [1 ]
机构
[1] Huazhong Univ Sci & Technol, Sch Energy & Power Engn, Wuhan 430074, Peoples R China
[2] Tsinghua Univ, Sch Aerosp, Beijing 100084, Peoples R China
基金
中国国家自然科学基金;
关键词
Computer simulation; Interface; Stresses; Czochralski method; Sapphire; GAAS; TRANSPORT;
D O I
10.1016/j.jcrysgro.2012.09.050
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
Global modeling is performed to predict electromagnetic field, heat transfer, melt flow, solid/liquid (S/L) interface shape, and thermal stress during RF-heated Czochralski (Cz) single crystal growth of sapphire. The relations between the convexity of the S/L interface and growth parameters, i.e., crystal rotation rate, crystal size, furnace insulation, and RF coil, are established. Thermal stress is represented by the von Mises stress, and the stress status in the growing crystal is characterized by the maximum von Mises stress. The curves regarding growth parameters and the maximum von Mises stress are obtained. According to the analysis, a flat or slightly convex S/L interface could be achieved by modifying the growth parameters, and the crystal quality could be improved by reducing thermal stress and its related defects. (C) 2012 Elsevier B.V. All right sreserved.
引用
收藏
页码:25 / 32
页数:8
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