Synthesis of poly {[bis(diethynylphenyl)sllylene]phenylene}s with highly heat-resistant properties and an application to conducting materials

被引：22

作者：

Ohshita, J ^{[1
]}

Iida, T ^{[1
]}

Ikeda, M ^{[1
]}

Uemura, T ^{[1
]}

Ohta, N ^{[1
]}

Kunai, A ^{[1
]}

机构：

[1] Hiroshima Univ, Grad Sch Engn, Dept Appl Chem, Higashihiroshima 7398527, Japan

来源：

JOURNAL OF ORGANOMETALLIC CHEMISTRY | 2004年 / 689卷 / 09期

关键词：

silicon-polymer; heat-resistant materials; conducting materials;

D O I：

10.1016/j.jorganchem.2004.01.033

中图分类号：

O61 [无机化学];

学科分类号：

070301 ; 081704 ;

摘要：

Poly{[bis(3,5-diethynylphenyl)silylene]-p-phenylene} was prepared by the reaction of poly[(diethoxysilylene)-p-phenylene] with 3,5-bis(trimethylsilylethynyl)phenyllithium, followed by desilylation of the resulting substitution product. The present polymer exhibited extremely high heat-resistance and their thermogravimetric analysis (TGA) in a nitrogen atmosphere showed the temperature of 5% weight loss (Td(5)) of 791 degreesC. Total weight loss at 1000 degreesC in TGA was determined to be 6% based on the initial weight. Treatment of a polymer film on a quartz plate at 1200 degreesC in vacuo led to the formation of a conducting thin film with a thickness of 74 nm and a conductivity of 9 S/cm. (C) 2004 Elsevier B.V. All rights reserved.

引用

页码：1540 / 1545

页数：6

共 16 条

[1]

[Anonymous], CHEM ORGANIC SILICON

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