Enhancing adhesion performance of no-flow prepreg to form multilayer structure of printed circuit boards with plasma-induced surface modification

被引：12
作者：
Chen, Yuanming [1 ]
Gao, Qingyao [1 ]
He, Xuemei [1 ]
Zhu, Kai [1 ]
Wang, Shouxu [1 ]
Wang, Chong [1 ]
He, Wei [1 ]
Zhou, Guoyun [1 ]
Zhang, Huaiwu [1 ]
机构：
[1] Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China
来源：
SURFACE & COATINGS TECHNOLOGY | 2018年 / 333卷
基金：
中国国家自然科学基金;
关键词：
Prepreg; Plasma modification; Adhesion performance; Multilayer structure; OXYGEN PLASMA; POLYIMIDE; ELECTRODEPOSITION; IMPROVEMENT; FIBERS; FILMS; RESIN;
D O I：
10.1016/j.surfcoat.2017.10.075
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
The surface of no-flow prepreg for multilayer structure of printed circuit boards was modified with O-2/CF4 plasma to improve the adhesion between copper foil and epoxy matrix in prepreg. Morphology and chemical composition of prepreg surface were measured by scanning electron microscopy and X-ray photoelectron spectroscopy, respectively. Effect of plasma modification time on roughness, wettability and adhesive performance were investigated by the tests on laser roughness, water contact angle and peel strength. The results indicated that peel strength between prepreg and copper foil achieved the maximum when modification time of plasma reached 20 min.
引用
收藏
页码：24 / 31
页数：8
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