Thermal deformation constraint using response surfaces for optimization of stacking sequences of composite laminates

被引:7
作者
Todoroki, Akira [1 ]
Ozawa, Takumi [1 ]
Mizutani, Yoshihiro [1 ]
Suzuki, Yoshiro [1 ]
机构
[1] Tokyo Inst Technol, Dept Mech Sci & Engn, Meguro Ku, Tokyo 1528552, Japan
关键词
buckling; laminates; thermal deformation; optimization; GENETIC ALGORITHM; BOUND METHOD; DESIGN; STRENGTH; PANELS; PARAMETERS; PLATES;
D O I
10.1080/09243046.2013.805502
中图分类号
TB33 [复合材料];
学科分类号
摘要
Carbon fiber reinforced plastic (CFRP) laminates are used extensively in aerospace structures. The laminated CFRP composite structures require optimal design of the stacking sequences. Modifications to the stacking sequences change the thermal deformation that results from the CFRP laminate curing process. Even if a stacking sequence provides maximum buckling load, the laminate is unacceptable if it displays large deformations after the curing process. Therefore, this study deals with the constraint of thermal deformation after the curing process. Maximization of the buckling load was targeted as the objective function here. Three types of response surfaces were proposed to estimate the thermal deformation and their fit was investigated. The mode classification method was found to be excellent. Using the mode classification response surface, a stacking sequence optimization to maximize the buckling stress was performed. The new mode classification method was shown to be appropriate for optimization of the curing process constraints.
引用
收藏
页码:265 / 279
页数:15
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