Performance Comparison Between Metallic Carbon Nanotube and Copper Nano-Interconnects

被引：38

作者：

Maffucci, Antonio ^{[1
]}

Miano, Giovanni ^{[2
]}

Villone, Fabio ^{[1
]}

机构：

[1] Univ Cassino, DAEIMI, I-03043 Cassino, Italy

[2] Univ Naples Federico II, DIEL, I-80125 Naples, Italy

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2008年 / 31卷 / 04期

关键词：

Interconnects; metallic carbon nanotubes; nanotechnology;

D O I：

10.1109/TADVP.2008.2005001

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper addresses the problem of scaling interconnects to nanometric dimensions in future very-large-scale integration applications. Traditional copper interconnects are compared to innovative interconnects made by bundles of metallic carbon nanotubes. A new model is presented to describe the propagation of electric signals along carbon nanotube (CNT) bundles, in the framework of the classical transmission line theory. A possible implementation of a future scaled microstrip based on CNT bundle is analyzed and compared to a conventional microstrip.

引用

收藏

页码：692 / 699

页数：8

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