Crosstalk Analysis and Optimization of High-Speed Interconnections

被引：0

作者：

Wang, Haidong ^{[1
]}

Song, Jian ^{[1
]}

Liu, Fengman ^{[1
]}

Xiang, Haifei ^{[1
]}

Gao, Wei ^{[1
]}

Wan, Lixi ^{[1
]}

机构：

[1] Chinese Acad Sci, Inst Microelect, Beijing, Peoples R China

来源：

2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) | 2011年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Crosstalk noise has become a major performance inhibitor in high speed digital system. This is especially the case in package designs, connector assemblies and circuit interconnects designs. With the simultaneous miniaturization of electronic systems and decreasing signal rise time, it is important to be able to predict major sources of crosstalk and to stay within the cross-talk budget for high-speed interconnects interfaces. In this paper, first, we focus on analyzing the crosstalk mechanism. Second, based on simulation, we propose methods to minimize crosstalk.

引用

页码：964 / 967

页数：4

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