Modeling and simulation of oxide dependent 2DEG sheet charge density in AlGaN/GaN MOSHEMT

被引:9
作者
Swain, R. [1 ]
Panda, J. [1 ]
Jena, K. [1 ]
Lenka, T. R. [1 ]
机构
[1] Natl Inst Technol, Dept Elect & Commun Engn, Microelect & VLSI Design Grp, Silchar 788010, Assam, India
关键词
2DEG; AlGaN/GaN; Eigenenergy; MOSHEMT; TCAD; FERMI-LEVEL; HEMT; GAN;
D O I
10.1007/s10825-015-0711-3
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Oxide dielectric present in metal oxide semiconductor high electron mobility transistor plays an important role during formation of two dimensional electron gas (2DEG). The sheet charge concentration (n(s)) is dependent on the Eigenenergy states present in triangular quantum well at AlGaN/GaN interface. The energy states are in fact functions of vertical electric field at the edge of the well. Therefore in this paper a model is developed to find out Electric field and flat-band voltage (V-T) by adopting energy band approach to incorporate oxide parameters in it unlike the conventional method of solving Poisson's equation, which is the uniqueness of this paper. The Eigenenergy states are dependent non-linearly on electric field. In the present case, three quantum states in the well are considered along with the Fermi-Dirac distribution function to obtain . The dependence of 2DEG density, electric field and flat-band voltage on the oxide parameters such as thickness and electrical permittivity is analyzed. With respect to thickness in SiO2 and Al2O3. n(s) shows inverse relationship; whereas in HfO2 it is direct due to positive charges accumulated at oxide/barrier interface. To the best of author's knowledge the work is first of its kind and due to lack of experimental data; the obtained results are compared with TCAD results to validate the model.
引用
收藏
页码:754 / 761
页数:8
相关论文
共 23 条
  • [1] Two-dimensional electron gases induced by spontaneous and piezoelectric polarization charges in N- and Ga-face AlGaN/GaN heterostructures
    Ambacher, O
    Smart, J
    Shealy, JR
    Weimann, NG
    Chu, K
    Murphy, M
    Schaff, WJ
    Eastman, LF
    Dimitrov, R
    Wittmer, L
    Stutzmann, M
    Rieger, W
    Hilsenbeck, J
    [J]. JOURNAL OF APPLIED PHYSICS, 1999, 85 (06) : 3222 - 3233
  • [2] [Anonymous], 2010, OPERATION MODELING M
  • [3] Effects of Short-Term DC-Bias-Induced Stress on n-GaN/AlGaN/GaN MOSHEMTs With Liquid-Phase-Deposited Al2O3 as a Gate Dielectric
    Basu, Sarbani
    Singh, Pramod K.
    Lin, Shun-Kuan
    Sze, Po-Wen
    Wang, Yeong-Her
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2010, 57 (11) : 2978 - 2987
  • [4] Bougrov V, 2001, PROPERTIES OF ADVANCED SEMICONDUCTOR MATERIALS: GAN, AIN, INN, BN, SIC, SIGE, P1
  • [5] METAL-(N) ALGAAS-GAAS TWO-DIMENSIONAL ELECTRON-GAS FET
    DELAGEBEAUDEUF, D
    LINH, NT
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1982, 29 (06) : 955 - 960
  • [6] AlGaN/GaN MOSHFETs with HfO2 gate oxide: A simulation study
    Hayashi, Y.
    Sugiura, S.
    Kishimoto, S.
    Mizutani, T.
    [J]. SOLID-STATE ELECTRONICS, 2010, 54 (11) : 1367 - 1371
  • [7] High-fMAX High Johnson's Figure-of-Merit 0.2-μm Gate AlGaN/GaN HEMTs on Silicon Substrate With AlN/SiNx Passivation
    Huang, Sen
    Wei, Ke
    Liu, Guoguo
    Zheng, Yingkui
    Wang, Xinhua
    Pang, Lei
    Kong, Xin
    Liu, Xinyu
    Tang, Zhikai
    Yang, Shu
    Jiang, Qimeng
    Chen, Kevin J.
    [J]. IEEE ELECTRON DEVICE LETTERS, 2014, 35 (03) : 315 - 317
  • [8] High-Temperature Performance of AlGaN/GaN MOSHEMT With SiO2 Gate Insulator Fabricated on Si (111) Substrate
    Husna, Fatima
    Lachab, Mohamed
    Sultana, Mahbuba
    Adivarahan, Vinod
    Fareed, Qhalid
    Khan, Asif
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2012, 59 (09) : 2424 - 2429
  • [9] Kirkpatrick C.J., 2012, ELECT DEVICE LETT, V33, P1240, DOI DOI 10.1109/LED.2012.2203782
  • [10] AN ANALYTICAL EXPRESSION FOR FERMI LEVEL VERSUS SHEET CARRIER CONCENTRATION FOR HEMT MODELING
    KOLA, S
    GOLIO, JM
    MARACAS, GN
    [J]. IEEE ELECTRON DEVICE LETTERS, 1988, 9 (03) : 136 - 138