Thermal Annealing Effects on Electrical Properties of Ir/Ru Schottky Contacts on n-InGaN

被引:0
|
作者
Padma, R. [1 ]
Lakshmi, B. Prasanna [1 ]
Reddy, V. Rajagopal [1 ]
机构
[1] Sri Venkateswara Univ, Semicond Devices Lab, Tirupati 517502, Andhra Pradesh, India
来源
PROCEEDING OF INTERNATIONAL CONFERENCE ON RECENT TRENDS IN APPLIED PHYSICS & MATERIAL SCIENCE (RAM 2013) | 2013年 / 1536卷
关键词
Schottky barrier height; ideality factor; series resistance; interface state density;
D O I
10.1063/1.4810304
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Effects of annealing on electrical properties of Ir/Ru Schottky contacts on n-InGaN have been investigated by current-voltage (I-V) measurements. The Schottky barrier height (SBH) is found to be 0.61 eV for as-deposited Ir/Ru Schottky contacts. For the contacts annealed at 200 and 300 degrees C, the SBH slightly increases and then slightly decreases after annealing at 400 degrees C and 500 degrees C. The series resistance (R-S) can be determined using Cheung's method. Besides, the energy distributions of interface state densities are determined by using the Terman's method. It is noted that the electrical properties of Ir/Ru Schottky contacts are improved after annealing at 300 degrees C. Based on these results, it is clear that Ir/Ru Schottky contact is an attractive metallization scheme for the fabrication of InGaN-based device applications.
引用
收藏
页码:469 / 470
页数:2
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