Copper Wire Bonding Concerns and Best Practices

被引：76

作者：

Chauhan, Preeti ^{[1
]}

Zhong, Z. W. ^{[2
]}

Pecht, Michael ^{[1
]}

机构：

[1] Univ Maryland, CALCE Elect Prod & Syst Ctr, College Pk, MD 20742 USA

[2] Nanyang Technol Univ, Sch Mech & Aerosp Engn, Singapore 639798, Singapore

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2013年 / 42卷 / 08期

关键词：

Wire bonding; copper; gold; oxidation; corrosion; humidity; INTEGRATED-CIRCUITS; BALL BONDS; CU; TEMPERATURE; RELIABILITY; AL; OPTIMIZATION; GROWTH; INTERMETALLICS; METALLIZATION;

D O I：

10.1007/s11664-013-2576-1

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Copper wire bonding of microelectronic parts has developed as a means to cut the costs of using the more mature technology of gold wire bonding. However, with this new technology, changes in the bonding processes as well as bonding metallurgy can affect product reliability. This paper discusses the challenges associated with copper wire bonding and the solutions that the industry has been implementing. The paper also provides information to enable customers to conduct qualification and reliability tests on microelectronic packages to facilitate adoption in their target applications.

引用

页码：2415 / 2434

页数：20

共 159 条

[1]

Abe H, 2012, 2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), P1117, DOI 10.1109/ECTC.2012.6248975

[2]

[Anonymous], 2012, TEX INSTR DRIV AD CO

[3]

[Anonymous], DEV COPPER WIRE BOND

[4]

[Anonymous], 12 INT C EL PACK TEC

[5]

[Anonymous], P 38 IEEE EL COMP C

[6]

Appelt B. K., 2010, EL SYST INT TECHN C, P1

[7]

Appelt B. K., 2010, IEEE CPMT S JAP 2010, P1

[8]

Appelt B. K., 2011, 12 INT C EL PACK TEC, P1

[9] Fine Pitch Copper Wire Bonding - Why Now? [J].

Appelt, Bernd K. ;

Tseng, Andy ;

Lai, Yi-Shao .

2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009), 2009, :469-+

[10]

Banda P, 2002, EL PACKAG TECH CONF, P344, DOI 10.1109/EPTC.2002.1185695

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