Evidence of the carrier mobility degradation in highly B-doped ultra-shallow junctions by Hall effect measurements

被引:3
|
作者
Severac, F. [1 ]
Cristiano, F. [1 ]
Bedel-Pereira, E. [1 ]
Lerch, W. [2 ]
Paul, S. [2 ]
Kheyrandish, H. [3 ]
机构
[1] Univ Toulouse, LAAS, CNRS, F-31077 Toulouse, France
[2] Mattson Thermal Prod GmbH, D-89160 Dornstadt, Germany
[3] CSMA, Manchester, Lancs, England
来源
MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS | 2008年 / 154卷 / 225-228期
关键词
Ultra-shallow junctions; Hole mobility; Hall effect; Boron-interstitial clusters; SIMS;
D O I
10.1016/j.mseb.2008.08.013
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper, we present an empirical method for the self-consistent interpretation of SIMS and Hall effect measurements of boron-doped ultra-shallow junctions that allows to estimate the activation level of the doped layers (maximum active dopant concentration, active dose fraction) and, for the case of partially activated structures, to assess whether or not the carrier mobility is affected by the electrically inactive BICs. Epitaxial structures realized by chemical vapour deposition (CVD) were studied. We found that, for partially electrically active structures, a degradation of the drift mobility due to the presence of BICs is shown, which is experimentally confirmed by low temperature Hall effect measurements. indicating the existence of an additional Coulomb-type scattering mechanism. In addition. the post-deposition annealing steps (either 1050 degrees C spike or 1300 degrees C Hash) are found to improve the activation level and induce a corresponding improvement of the carrier mobility, which is clearly associated to the progressive dissolution of the BICs during annealing. (C) 2008 Elsevier B.V. All rights reserved.
引用
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页码:225 / 228
页数:4
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