共 9 条
[2]
Davis MF, 2002, IEEE MTT S INT MICR, P2217, DOI 10.1109/MWSYM.2002.1012313
[3]
Hong J. S. G., 2001, WILEY MICRO
[6]
A fully embedded 60-GHz novel BPF for LTCC system-in-package applications
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
2006, 29 (04)
:804-809
[7]
System design issues for 3D system-in-package (SiP)
[J].
54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS,
2004,
:610-615
[9]
Wang LT, 2010, POWER-AWARE TESTING AND TEST STRATEGIES FOR LOW POWER DEVICES, P1, DOI 10.1007/978-1-4419-0928-2_1