Growth of High-Quality Hexagonal Boron Nitride Single-Layer Films on Carburized Ni Substrates for Metal-Insulator-Metal Tunneling Devices

被引:11
作者
He, Yanwei [1 ]
Tian, Hao [1 ]
Das, Protik [1 ]
Cui, Zhenjun [1 ]
Pena, Pedro [1 ]
Chiang, Ivan [1 ]
Shi, Wenhao [1 ]
Xu, Long [1 ]
Li, Yuan [1 ]
Yang, Tianchen [1 ]
Isarraraz, Miguel [1 ]
Ozkan, Cengiz S. [2 ,3 ]
Ozkan, Mihrimah [1 ]
Lake, Roger K. [1 ]
Liu, Jianlin [1 ]
机构
[1] Univ Calif Riverside, Dept Elect & Comp Engn, Riverside, CA 92521 USA
[2] Univ Calif Riverside, Mat Sci & Engn Program, Riverside, CA 92521 USA
[3] Univ Calif Riverside, Dept Mech Engn, Riverside, CA 92521 USA
基金
美国国家科学基金会;
关键词
hexagonal boron nitride (h-BN); molecular beam epitaxy (MBE); substrate engineering; two-dimensional (2D); electrical device; FIELD-EFFECT TRANSISTORS; DIELECTRIC-BREAKDOWN; GRAPHENE; EXFOLIATION; TEMPERATURE; DEPOSITION; TRANSPORT; IMAGE;
D O I
10.1021/acsami.0c07201
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Two-dimensional (2D) hexagonal boron nitride (h-BN) plays a significant role in nanoscale electrical and optical devices because of its superior properties. However, the difficulties in the controllable growth of high-quality films hinder its applications. One of the crucial factors that influence the quality of the films obtained via epitaxy is the substrate property. Here, we report a study of 2D h-BN growth on carburized Ni substrates using molecular beam epitaxy. It was found that the carburization of Ni substrates with different surface orientations leads to different kinetics of h-BN growth. While the carburization of Ni(100) enhances the h-BN growth, the speed of the h-BN growth on carburized Ni(111) reduces. Asgrown continuous single-layer h-BN films are used to fabricate Ni/h-BN/Ni metal-insulator-metal (MIM) devices, which demonstrate a high breakdown electric field of 12.9 MV/cm.
引用
收藏
页码:35318 / 35327
页数:10
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