Photosensitive Polyimide for Packaging Applications

被引：29

作者：

Tomikawa, Masao ^{[1
]}

Okuda, Ryoji ^{[1
]}

Ohnishi, Hiroyuki ^{[1
]}

机构：

[1] Toray Industries Ltd, Elect & Imaging Mat Res Labs, Otsu, Shiga 5200842, Japan

来源：

JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY | 2015年 / 28卷 / 01期

关键词：

Positive-tone photosensitive polyimide; low residual stress; low temperature curable;

D O I：

10.2494/photopolymer.28.73

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

Recently packaging technologies progress so much for high density, low profile and small foot print. For those applications, Photo sensitive polyimide (PSPI) applied as a re-distribution layer for the package. The PSPI was required to have good adhesion to wiring metal with low temperature curable nature. We developed the PSPIs with low temperature curability for emerging packaging applications.

引用

页码：73 / 77

页数：5

共 7 条

[1] ADHESION OF POLYIMIDES TO METAL AND CERAMIC SURFACES - AN OVERVIEW
BUCHWALTER, LP
[J]. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 1990, 4 (09) : 697 - 721
[2] HAYASE S, 1993, POLYM ADVAN TECHNOL, V4, P302
[3] The Design of Photosensitive Polyimide Materials for Buffer Coating Processes
Kim, Jae Hyun
[J]. JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, 2009, 22 (03) : 403 - 405
[4] Saiki S., 1982, J ELECTROCHEM SOC, V132, P2700
[5] Yoshinaga K., 2010, SCI TRENDS, V23
[6] A novel positive working photosensitive polyimide for wafer-level CSP packages
Yuba, T
Suwa, M
Fujita, Y
Tomikawa, M
Ohbayashi, G
[J]. JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, 2002, 15 (02) : 201 - 203
[7] Soft Baking Effect on Lithographic Performance by Positive Tone Photosensitive Polyimide
Yuba, Tomoyuki
Okuda, Ryoji
Tomikawa, Masao
Kim, Jae Hyun
[J]. JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, 2010, 23 (06) : 775 - 779

← 1 →