Uniaxial tensile tests and dynamic mechanical analysis of satin weave reinforced epoxy shape memory polymer composite

被引:27
作者
Hu, Jianhui [1 ,2 ,3 ]
Chen, Wujun [1 ]
Fan, Pengxuan [1 ]
Gao, Jifeng [1 ]
Fang, Guangqiang [4 ]
Cao, Zhengli [4 ]
Peng, Fujun [4 ]
机构
[1] Shanghai Jiao Tong Univ, Space Struct Res Ctr, Shanghai 200240, Peoples R China
[2] State Key Lab Ocean Engn, Shanghai 200240, Peoples R China
[3] Collaborat Innovat Ctr Adv Ship & Deep Sea Explor, Shanghai 200240, Peoples R China
[4] Aerosp Syst Engn Shanghai, Shanghai 201108, Peoples R China
关键词
Deployable structures; Dynamic mechanical analysis; Elastic modulus; Epoxy shape memory polymer composite; Glass transition temperature; Mechanical properties; SYSTEMS;
D O I
10.1016/j.polymertesting.2017.09.038
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The utilization of epoxy shape memory polymer composite (SMPCs) as engineering materials for deployable structures has attracted considerable attention in recent decades due to high strength and satisfactory stiffness in comparison with shape memory polymers (SMPs). Knowledge of static and dynamic mechanical properties is essential for analyzing structural behavior and recovery properties, especially for new epoxy SMPCs. In this paper, a new weave reinforced epoxy shape memory polymer composite was prepared with satin weave technique and resin transfer molding technique. Uniaxial tensile tests and dynamic mechanical analysis were carried out to obtain basic mechanical properties and glass transition temperatures, respectively. The tensile strength and breaking elongation of warp specimens were comparable with those of weft specimens. The increment of elastic modulus and hysteresis loop areas became smaller with loading cycles, meaning that cyclic tests could obtain approximate stable mechanical properties. For dynamic mechanical properties, glass transition temperature (T-g) obtained from storage modulus curves was lower than that determined from tan delta curves and T(g)s in the warp and weft directions were similar (29.4 degrees C vs 29.7 degrees C). Moreover, the storage modulus in response to T-g was two orders of magnitude less than that with respect to low temperature, which demonstrated the easy processibility of epoxy SMPCs near glass transition temperature. In general, this study could provide useful observations and basic mechanical properties of new epoxy SMPCs.
引用
收藏
页码:235 / 241
页数:7
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