Characterization of thin film adhesion by MEMS shaft-loading blister testing

被引：16

作者：

Berdova, Maria ^{[1
,2
]}

Lyytinen, Jussi ^{[1
]}

Grigoras, Kestutis ^{[3
]}

Baby, Anu ^{[1
,2
]}

Kilpi, Lauri ^{[3
]}

Ronkainen, Helena ^{[3
]}

Franssila, Sami ^{[1
,2
]}

Koskinen, Jari ^{[1
]}

机构：

[1] Aalto Univ, Dept Mat Sci & Engn, Aalto 00076, Finland

[2] Aalto Univ, Micronova Nanofabricat Ctr, Aalto 00076, Finland

[3] VTT Tech Res Ctr Finland, FI-02044 Espoo, Finland

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A | 2013年 / 31卷 / 03期

关键词：

16;

D O I：

10.1116/1.4801921

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

A new microelectromechanical system shaft-loaded blister test was developed and demonstrated to provide stability, repeatability, and simultaneous quantitative measurements of adhesion between thin films deposited on a silicon substrate. The authors assessed adhesion of sputtered platinum, copper, and chromium/copper (300 nm) to underlaying atomic layer deposited (ALD) aluminum oxide. The average adhesion energies for thin films on ALD aluminum oxide were found to be 1.15 +/- 0.1 J/m(2) for platinum thin films, 1.4 J/m(2) for copper thin films, and 1.75 J/m(2) for chromium/copper. (C) 2013 American Vacuum Society.

引用

页数：5

共 16 条

[1]

[Anonymous], INT J FRACT

[2] Micro-scratch test study of TiN films grown on silicon by chemical vapor deposition [J].

Benayoun, S ;

Hantzpergue, JJ ;

Bouteville, A .

THIN SOLID FILMS, 2001, 389 (1-2) :187-193

[3] Approaches to investigate delamination and interfacial toughness in coated systems: an overview [J].

Chen, Jinju ;

Bull, S. J. .

JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2011, 44 (03)

[4] Recent developments in thin film adhesion measurement [J].

Cordill, MJ ;

Bahr, DF ;

Moody, NR ;

Gerberich, WW .

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2004, 4 (02) :163-168

[5]

Damayanti M, 2005, MAT SCI ENG B-SOLID, V121, P193, DOI 10.1016/j.mseb.2005.03.030

[6] Adhesion and debonding of multi-layer thin film structures [J].

Dauskardt, R ;

Lane, M ;

Ma, Q ;

Krishna, N .

ENGINEERING FRACTURE MECHANICS, 1998, 61 (01) :141-162

[7] Shaft loaded blister test for metal/ceramic brazing fracture [J].

Kozlova, O. ;

Braccini, M. ;

Eustathopoulos, N. ;

Devismes, M-F. ;

Dupeux, M. .

MATERIALS LETTERS, 2008, 62 (21-22) :3626-3628

[8]

Lacombe R., 2006, Adhesion measurement methods theory and practice

[9]

MALYSHEV BM, 1965, INT J FRACT MECH, V1, P114

[10] ADHESION MEASUREMENT OF THIN-FILMS BY INDENTATION [J].

MATTHEWSON, MJ .

APPLIED PHYSICS LETTERS, 1986, 49 (21) :1426-1428

← 1 2 →