An Information Theoretic Argument on the Form of Damage Accumulation in Solids

被引:5
作者
Bhate, D. [1 ]
Mysore, K. [1 ]
Subbarayan, G. [1 ]
机构
[1] Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
关键词
fracture; information theory; maximum entropy principle; continuum thermodynamics; cohesive zone models; solder; FRACTURE; MECHANICS; CONCRETE; MODEL; SIZE; ZONE;
D O I
10.1080/15376494.2011.572246
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
An approach to modeling failure that is inspired by two experimentally observed facts is presented. These observations are: (1) cracks grow as the end result of a irreversible, dissipative process, and (2) fracture has an inherent lengthscale, timescale, and/or spatial hierarchy influenced by the (possibly dynamically changing) microstructural state. The second of these facts enables one to view the seemingly deterministic cracks observed at higher levels of hierarchy as resulting from uncertain events at lower-levels of hierarchy associated with microstructural variations. A key mathematical result developed in Information Theory together with the maximum entropy principle of Statistical Mechanics is utilized to derive a form of damage that is "maximally non-committal" about microstructural uncertainty in lower levels of fracture hierarchy. The irrecoverable energy that is expended in the creation of new surfaces or in plastic dissipation is associated with the microstructural damage using continuum thermodynamics and J2 plasticity theory. The formulated result is shown to provide an exponential form of damage accumulation under constant dissipation rate, and a form similar to the popular Smith-Ferrante traction-separation law of cohesive zone models under conditions of decreasing dissipation rate. Finally, the model is validated through comparisons with experimental observations of damage accumulation during cyclic fatigue testing of solder alloys.
引用
收藏
页码:184 / 195
页数:12
相关论文
共 36 条
  • [1] Skeleton of Euplectella sp.:: Structural hierarchy from the nanoscale to the macroscale
    Aizenberg, J
    Weaver, JC
    Thanawala, MS
    Sundar, VC
    Morse, DE
    Fratzl, P
    [J]. SCIENCE, 2005, 309 (5732) : 275 - 278
  • [2] Akay H. U., 1993, International Journal of Microcircuits and Electronic Packaging, V16, P79
  • [3] [Anonymous], 1999, Introductory statistical mechanics
  • [4] [Anonymous], GEOMECHANICS RES SER
  • [5] Bagheri Z., COMMUNICATION
  • [6] A thermodynamic framework for damage mechanics of solder joints
    Basaran, C
    Han, CY
    [J]. JOURNAL OF ELECTRONIC PACKAGING, 1998, 120 (04) : 379 - 384
  • [7] Is the cause of size effect on structural strength fractal or energetic-statistical?
    Bazant, ZP
    Yavari, A
    [J]. ENGINEERING FRACTURE MECHANICS, 2005, 72 (01) : 1 - 31
  • [8] Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pb-free solder joints
    Bieler, T. R.
    Jiang, H.
    Lehman, L. P.
    Kirkpatrick, T.
    Cotts, E. J.
    [J]. 56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 1462 - +
  • [9] Hierarchical crack pattern as formed by successive domain divisions. II. From disordered to deterministic behavior
    Bohn, S
    Platkiewicz, J
    Andreotti, B
    Adda-Bedia, M
    Couder, Y
    [J]. PHYSICAL REVIEW E, 2005, 71 (04):
  • [10] Hierarchical crack pattern as formed by successive domain divisions. I. Temporal and geometrical hierarchy
    Bohn, S
    Pauchard, L
    Couder, Y
    [J]. PHYSICAL REVIEW E, 2005, 71 (04):