SMPS Ringing Noise Modeling and Managing Methodology for RFI Solutions in Mobile Platforms

被引:6
作者
Kim, Kiyeong [1 ]
Shim, Hwan-Woo [1 ]
Scogna, Antonio Ciccomancini [1 ]
Hwang, Chulsoon [2 ]
机构
[1] Samsung Elect, Mobile Commun Business Div, Suwon KS002, South Korea
[2] Missouri Univ Sci & Technol, EMC Lab, Rolla, MO 65401 USA
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2018年 / 8卷 / 04期
基金
美国国家科学基金会;
关键词
Mobile platform; RF interference (RFI); ringing noise; switched-mode power supply (SMPS);
D O I
10.1109/TCPMT.2018.2799330
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In mobile platforms, RF interference issues caused by the switched-mode power supply (SMPS) ringing noise often arise in the on-the-go mode and the charging mode of the interface power management integrated circuits. In this paper, we introduce the modeling method for the SMPS ringing noise in the conventional two-level dc-dc converters and then, based on the modeling insight from the two-level dc-dc converter, we investigate and validate the modeling of the SMPS ringing noise in the three-level buck converters, which are newly adopted SMPSs for fast charging in mobile devices. To reduce such noise, we propose the novel SMPS noise-managing methodologies that handle the printed-circuit-board-level design optimization in mobile devices.
引用
收藏
页码:554 / 561
页数:8
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