Investigation on current density limits in power printed circuit boards

被引：13

作者：

Coppola, Luisa ^{[1
]}

Cottet, Didier ^{[1
]}

Wildner, Franz ^{[1
]}

机构：

[1] ABB Switzerland Ltd, Corp Res, CH-5405 Baden Daettwil, Switzerland

来源：

APEC 2008: TWENTY-THIRD ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, VOLS 1-4 | 2008年

关键词：

D O I：

10.1109/APEC.2008.4522723

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Joule heating of copper traces is known as one major failure cause in high current printed circuit boards. The paper summarizes tests that were performed to investigate the actual failure mechanisms related to high current densities. The current values at which the boards failed show how conservative the present design rules for traces and via holes are. An electro-thermal modeling method for printed circuit board is proposed for further analysis of current and temperature distributions in different layout configurations and under different load conditions.

引用

页码：205 / 210

页数：6

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