Design and fabrication process of silicon micro-calorimeters on simple SOI technology for X-ray spectral imaging

被引:6
作者
Aliane, A. [1 ]
Agnese, P. [1 ]
Pigot, C. [2 ]
Sauvageot, J. L. [2 ]
de Moro, F. [1 ]
Ribot, H. [1 ]
Gasse, A. [1 ]
Szeflinski, V. [2 ]
Gobil, Y. [1 ]
机构
[1] CEA, LETI, MINATEC, F-38054 Grenoble, France
[2] Univ Paris Diderot, Lab AIM, CNRS, CEA DSM IRFU Serv Astrophys,CEA Saclay, F-91191 Gif Sur Yvette, France
关键词
X-ray; tantalum; indium bump; micro-calorimeter; SOI; ion implantation; VRH; micro-technology;
D O I
10.1016/j.nima.2008.06.029
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
Several successful development programs have been conducted on infra-red bolometer arrays at the "Commissariat a l'Energie Atomique" (CEA-LET1 Grenoble) in collaboration with the CEA-SAp (Saclay); taking advantage of this background, we are now developing an X-ray spectro-imaging camera for next generation space astronomy missions, using silicon only technology. We have developed monolithic silicon micro-calorimeters based on implanted thermistors in an improved array that could be used for future space missions. The 8 x 8 array consists of a grid of 64 suspended pixels fabricated on a silicon on insulator (SOI) wafer. Each pixel of this detector array is made of a tantalum (Ta) absorber, which is bound by means of indium bump hybridization, to a silicon thermistor. The absorber array is bound to the thermistor array in a collective process. The fabrication process of our detector involves a combination of standard technologies and silicon bulk micro-machining techniques, based on deposition, photolithography and plasma etching steps. Finally, we present the results of measurements performed on these four primary building blocks that are required to create a detector array up to 32 x 32 pixels in size. (C) 2008 Elsevier B.V. All rights reserved.
引用
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页码:210 / 214
页数:5
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