Novel organic polymer for UV-enhanced substrate conformal imprint lithography

被引：13

作者：

Fader, R. ^{[1
,3
]}

Schmitt, H. ^{[1
]}

Rommel, M. ^{[1
]}

Bauer, A. J. ^{[1
,3
]}

Frey, L. ^{[1
,2
,3
]}

Ji, R. ^{[4
]}

Hornung, M. ^{[4
]}

Brehm, M. ^{[5
]}

Vogler, M. ^{[6
]}

机构：

[1] Fraunhofer Inst Integrated Syst & Device Technol, D-91058 Erlangen, Germany

[2] Univ Erlangen Nurnberg, Chair Electron Devices, D-91058 Erlangen, Germany

[3] Erlangen Grad Sch Adv Opt Technol SAOT, D-91058 Erlangen, Germany

[4] SUSS MicroTec Lithog GmbH, D-85748 Garching, Germany

[5] DELO Ind Adhes, D-86949 Windach, Germany

[6] Micro Resist Technol GmbH, D-12555 Berlin, Germany

来源：

MICROELECTRONIC ENGINEERING | 2012年 / 98卷

关键词：

Substrate conformal imprint lithography; SCIL; Soft lithography; UV curing epoxides; PDMS stamp;

D O I：

10.1016/j.mee.2012.07.010

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this work, a novel kind of UV curing polymer is introduced as promising resist for UV-enhanced substrate conformal imprint lithography (UV-SCIL). This fully organic polymer is an epoxy based material and can crosslink via UV exposure to form a solid layer. The curing time of 17 s for this epoxy based resist is ten times shorter compared to commonly used resists for UV-SCIL. Imprints with this material are shown in this work as well as results of an HBr dry etch process of silicon, where the material served as etching mask. Using this polymer as resist for UV-SCIL enables shorter process times whereby the fidelity of the structures remains high. (C) 2012 Elsevier BM. All rights reserved.

引用

页码：238 / 241

页数：4

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