A NEW METHOD OF CURING EPOXY RESIN BY USING BIS(HEPTAPHENYLALUMINOSILSESQUIOXANE) AS A HARDENER

被引：0
作者：
Chmielewska, Danuta [1 ]
Barczewski, Mateusz [1 ]
Sterzynski, Tomasz [1 ]
机构：
[1] Politechn Poznanska, Inst Technol Mat, PL-61138 Poznan, Poland
来源：
POLIMERY | 2013年 / 58卷 / 04期
关键词：
epoxy resin; POSS; thermal analysis; crosslinking; THERMOMECHANICAL PROPERTIES; THERMAL-PROPERTIES; POSS; MORPHOLOGY; SILSESQUIOXANE; NANOCOMPOSITES; COMPOSITES;
D O I：
暂无
中图分类号：
O63 [高分子化学（高聚物）];
学科分类号：
070305 ; 080501 ; 081704 ;
摘要：
The curing process of epoxy resin Epidian 6 with bis(heptaphenylaluminosilsesquioxane) was studied. The curing conditions for the defined compositions were established on the basis of measurements made during the crosslinking reaction. Differential scanning calorimetry (DSC) was used to determine the temperature of the exothermal reaction related to the course of the curing process. Also, the temperature of crosslinking process and gel time at ambient temperature were determined. The homogeneity of the distribution of FOSS additives in the epoxy matrix was investigated using microscopic analysis (SEM). Fourier transform infrared (FT-IR) spectroscopy was used to evaluate the chemical changes in the resin. It was shown that bis(heptaphenylaluminosilsesquioxane) can be applied as a curing agent for epoxy resins, with the main advantages of a low curing temperature and long life time.
引用
收藏
页码：270 / 275
页数：6
相关论文
共 50 条
  • [41] Behavior of polyamidoamine dendrimers as curing agents in bis-phenol A epoxy resin systems
    Cheng, YY
    Chen, DZ
    Fu, RQ
    He, PS
    POLYMER INTERNATIONAL, 2005, 54 (03) : 495 - 499
  • [42] The Physicochemical Characterization of New "Green" Epoxy-Resin Hardener Made from PET Waste
    Sterligov, Grigorii K.
    Rzhevskiy, Sergey A.
    Isaeva, Dilshodakhon K.
    Belov, Nikita M.
    Rasskazova, Maria A.
    Drokin, Egor A.
    Topchiy, Maxim A.
    Minaeva, Lidiya, I
    Babkin, Alexander, V
    Erdni-Goryaev, Erdni M.
    Kepman, Alexey, V
    Asachenko, Andrey F.
    POLYMERS, 2022, 14 (20)
  • [43] Curing of epoxy resin contaminated with water
    Chen, JY
    Nakamura, T
    Aoki, K
    Aoki, Y
    Utsunomiya, T
    JOURNAL OF APPLIED POLYMER SCIENCE, 2001, 79 (02) : 214 - 220
  • [44] Curing Kinetics and Properties of Epoxy Resin with 1,4-bis(2,4-diaminophenoxy)benzene
    虞鑫海
    CHEN Shuo
    徐永芬
    JournalofWuhanUniversityofTechnology(MaterialsScience), 2018, 33 (05) : 1256 - 1262
  • [45] Preparation, curing kinetic and properties of a novel amine with flexible polyoxypropylene side chain curing agent for epoxy resin
    Wang, Guiyou
    Jiang, Guanlan
    Zhang, Jie
    THERMOCHIMICA ACTA, 2014, 589 : 197 - 206
  • [46] Curing Kinetics and Properties of Epoxy Resin with 1, 4-bis (2, 4-diaminophenoxy)benzene
    Xinhai Yu
    Shuo Chen
    Yongfen Xu
    Journal of Wuhan University of Technology-Mater. Sci. Ed., 2018, 33 : 1256 - 1262
  • [47] Effect of synergistic environmental conditions on thermal properties of a cold curing epoxy resin
    Maljaee, Hamid
    Ghiassi, Bahman
    Lourenco, Paulo B.
    COMPOSITES PART B-ENGINEERING, 2017, 113 : 152 - 163
  • [48] Curing kinetics of epoxy resin by non-isothermal DSC method
    Li, H. (liheng198801@163.com), 2013, Journal of Solid Rocket Technology, P.O. Box 120, Xi'an, 710025, China (36): : 266 - 269+284
  • [49] Curing Kinetics and Properties of Epoxy Resin with 1, 4-bis (2, 4-diaminophenoxy)benzene
    Yu Xinhai
    Chen Shuo
    Xu Yongfen
    JOURNAL OF WUHAN UNIVERSITY OF TECHNOLOGY-MATERIALS SCIENCE EDITION, 2018, 33 (05): : 1256 - 1262
  • [50] Study on polyblending epoxy resin adhesive with lignin I-curing temperature
    Kong, Xianzhi
    Xu, Zhifeng
    Guan, Lizhu
    Di, Mingwei
    INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2014, 48 : 75 - 79
12345