Laser Technology for Use in Recycyling Printed Circuit Boards

被引：1
|
作者：
Kuznetsov, G., V [1 ]
Kats, M. D. [1 ]
Kats, I. M. [1 ]
机构：
[1] Natl Res Tomsk Polytech Univ, Tomsk, Russia
来源：
CHEMICAL AND PETROLEUM ENGINEERING | 2022年 / 58卷 / 5-6期
关键词：
laser heating approach for recycyling printed laser board; melting time of metallic component; melting time of metal component; rate of travel of printed circuit board; width of metal layer; width of base layer; thermal conductivity equations; numerical solution;
D O I：
10.1007/s10556-022-01119-8
中图分类号：
TQ [化学工业];
学科分类号：
0817 ;
摘要：
The potential for effective implementation of laser technology is evaluated from the results of mathematical simulation of heat transport processes under conditions corresponding to different implementations of laser technology for recycyling printed circuit board. The strength and duration of laser radiation in which such a process of recycling of laser radiation may be energy efficient are established.
引用
收藏
页码：491 / 498
页数：8
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