The Investigation of Plating Technologies for Front Fingers of c-Si Solar Cells

被引：0

作者：

Sun, Shiyang ^{[1
]}

Long, Jianping ^{[1
]}

Zhang, Bo ^{[2
]}

机构：

[1] Chengdu Univ Technol, Coll Mat & Chem & Chem Engn, Chengdu 610059, Peoples R China

[2] Univ Elect Sci & Technol China, Sch Energy Sci & Engn, Chengdu 611731, PR, Peoples R China

来源：

RENEWABLE AND SUSTAINABLE ENERGY II, PTS 1-4 | 2012年 / 512-515卷

关键词：

solar cell; metallization; electroless plating; electroplating; photoplating; METALLIZATION; COPPER;

D O I：

10.4028/www.scientific.net/AMR.512-515.198

中图分类号：

TE [石油、天然气工业]; TK [能源与动力工程];

学科分类号：

0807 ; 0820 ;

摘要：

Besides silicon wafers, the metallization of solar cells is the most expensive process in the mass production of solar cells nowadays. Therefore, the development of cost-effective metallization technologies is very important for the reduction of manufacturing cost. In this article, we will introduce two novel approaches for the metallization of c-Si solar cells: (i) electroless plated Ni and electroplated Cu; (ii) photoplated Ni and Cu. It is believed that high efficiency and low cost solar cells can be fabricated taking advantages of the improved metallization methods.

引用

页码：198 / +

页数：2

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