共 24 条
Electrochemical migration investigations on Sn-Sb solder alloys using 3.5 wt% NaCl solution
被引:0
作者:
Medgyes, Balint
[1
]
Kiss, Robert
[1
]
Szurdan, Szabolcs
[2
]
Rigler, Daniel
[1
]
Gal, Laszlo
[1
]
Berenyi, Richard
[1
]
Harsanyi, Gabor
[1
]
机构:
[1] Budapest Univ Technol & Econ, Dept Elect Technol, Budapest, Hungary
[2] Univ Miskolc, Fac Mat Sci & Engn, Miskolc, Hungary
来源:
2017 40TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE)
|
2017年
关键词:
SN-3.0AG-0.5CU SOLDER;
WHISKER GROWTH;
IN-SITU;
TIN;
CHLORIDE;
D O I:
暂无
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
ECM (electrochemical migration) is sort of short failure mechanism that can lead to series defect in case of loaded circuits, when moisture exist on/in a conductor-dielectric-conductor system. Water drop (WD) test and scanning electron microscopy - energy disperse spectroscopy (SEM-EDS) methods were used to investigate the ECM behavior on different Sn-Sb alloys and pure Sn was the reference. The results show that all of the samples have similar ECM risk comparing to the pure Sn. However, in case of Sn95-Sb5 solder alloy antimony was found in the dendrites next to Sn content, which was dominated during the ECM processes in all cases.
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页数:4
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