Electrochemical migration investigations on Sn-Sb solder alloys using 3.5 wt% NaCl solution

被引：0
|
作者：
Medgyes, Balint [1 ]
Kiss, Robert [1 ]
Szurdan, Szabolcs [2 ]
Rigler, Daniel [1 ]
Gal, Laszlo [1 ]
Berenyi, Richard [1 ]
Harsanyi, Gabor [1 ]
机构：
[1] Budapest Univ Technol & Econ, Dept Elect Technol, Budapest, Hungary
[2] Univ Miskolc, Fac Mat Sci & Engn, Miskolc, Hungary
来源：
2017 40TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE) | 2017年
关键词：
SN-3.0AG-0.5CU SOLDER; WHISKER GROWTH; IN-SITU; TIN; CHLORIDE;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
ECM (electrochemical migration) is sort of short failure mechanism that can lead to series defect in case of loaded circuits, when moisture exist on/in a conductor-dielectric-conductor system. Water drop (WD) test and scanning electron microscopy - energy disperse spectroscopy (SEM-EDS) methods were used to investigate the ECM behavior on different Sn-Sb alloys and pure Sn was the reference. The results show that all of the samples have similar ECM risk comparing to the pure Sn. However, in case of Sn95-Sb5 solder alloy antimony was found in the dendrites next to Sn content, which was dominated during the ECM processes in all cases.
引用
收藏
页数：4
相关论文
共 50 条
  • [1] Electrochemical Migration Investigation on Lead-Free Sn-based Solder Alloys in 3.5 wt.% NaCl Solution
    Gharaibeh, Ali
    Rigler, Daniel
    Medgyes, Balint
    Harsanyi, Gabor
    2022 45TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2022,
  • [2] Electrochemical behavior of Sn-9Zn-xCu solder alloy in 3.5 wt% NaCl solution at room temperature
    Jaiswal, Dheeraj
    Kumar, Sharvan
    Behera, C.K.
    Materials Today Communications, 2022, 33
  • [3] Electrochemical behavior of Sn-9Zn-xCu solder alloy in 3.5 wt% NaCl solution at room temperature
    Jaiswal, Dheeraj
    Kumar, Sharvan
    Behera, C. K.
    MATERIALS TODAY COMMUNICATIONS, 2022, 33
  • [4] Electrochemical corrosion behaviour of Sn-Sb solder alloys: the roles of alloy Sb content and type of intermetallic compound
    Dias, Marcelino
    Verissimo, Nathalia C.
    Regone, Natal N.
    Freitas, Emmanuelle S.
    Cheung, Noe
    Garcia, Amauri
    CORROSION ENGINEERING SCIENCE AND TECHNOLOGY, 2021, 56 (01) : 11 - 21
  • [5] Electrochemical behaviour of lead-free Sn-In-Al solders alloys in 3.5 wt.% NaCl solution
    Jaiswal, Dheeraj
    Pathote, Dileep
    Singh, Vikrant
    Behera, C. K.
    MATERIALS TODAY-PROCEEDINGS, 2022, 57 : 187 - 193
  • [6] Evaluation of cooling rate on electrochemical behavior of Sn-0.3Ag-0.9Zn solder alloy in 3.5 wt% NaCl solution
    Wang, Huan
    Gao, Zhi ming
    Liu, Yongchang
    Li, Chong
    Ma, Zongqing
    Yu, Liming
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2015, 26 (01) : 11 - 22
  • [7] Investigations on the Corrosion Properties of Sn-0.5Cu-Bi-xAg Lead Free Solder Alloys in 3.5% NaCl Solution
    Jayesh, S.
    Elias, Jacob
    TRANSACTIONS ON ELECTRICAL AND ELECTRONIC MATERIALS, 2021, 22 (02) : 150 - 159
  • [8] Investigations on the Corrosion Properties of Sn–0.5Cu–Bi–xAg Lead Free Solder Alloys in 3.5% NaCl Solution
    S. Jayesh
    Jacob Elias
    Transactions on Electrical and Electronic Materials, 2021, 22 : 150 - 159
  • [9] Electrochemical migration of Sn and Sn solder alloys: a review
    Zhong, Xiankang
    Chen, Longjun
    Medgyes, Balint
    Zhang, Zhi
    Gao, Shujun
    Jakab, Laszlo
    RSC ADVANCES, 2017, 7 (45): : 28186 - 28206
  • [10] Creep properties of Sn-Sb based lead-free solder alloys
    El-Daly, A. A.
    Swilem, Y.
    Hammad, A. E.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 471 (1-2) : 98 - 104
12345