Effects of superimposed ultrasound on deformation of gold

被引：77
作者：
Lum, I. [1 ]
Huang, H. [1 ,2 ]
Chang, B. H. [2 ]
Mayer, M. [1 ]
Du, D. [2 ]
Zhou, Y. [1 ]
机构：
[1] Univ Waterloo, Dept Mech & Mechatron Engn, Waterloo, ON N2L 3G1, Canada
[2] Tsinghua Univ, Dept Mech Engn, Beijing 100084, Peoples R China
来源：
JOURNAL OF APPLIED PHYSICS | 2009年 / 105卷 / 02期
基金：
加拿大自然科学与工程研究理事会; 中国国家自然科学基金;
关键词：
annealing; dislocations; gold; plastic deformation; softening; ultrasonic effects; vibrations; METAL;
D O I：
10.1063/1.3068352
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
The effects of superimposed ultrasound vibration on plastic deformation of gold are studied both during and after the vibration using an ultrasonic ball bonding machine. It is found that when ultrasonic irradiation is applied along with mechanical force, the metal is softer than when deformed without the vibration. After ultrasound is turned off, the deformed metal remains softer if previously deformed with ultrasound. Possible mechanisms for the acoustic residual softening are discussed as compared to residual hardening. The acoustic residual effect is attributed to the net balance between ultrasound's dynamic annealing and its potential opposing effect on activating and multiplying dislocations.
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页数：5
相关论文
共 19 条
  • [1] CULP DR, 1973, ULTRASON S P, V195
  • [2] Investigation of microstructural processes during ultrasonic wedge/wedge bonding of AlSi1 wires
    Geissler, U
    Schneider-Ramelow, M
    Lang, KD
    Reichl, H
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (01) : 173 - 180
  • [3] Gindin I., 1972, Soviet Physics Journal, V15, P192, DOI DOI 10.1007/BF00819431
  • [4] Bonding wire characterization using automatic deformability measurement
    Hang, C. J.
    Lum, I.
    Lee, J.
    Mayer, M.
    Wang, C. Q.
    Zhou, Y.
    Hong, S. J.
    Lee, S. M.
    [J]. MICROELECTRONIC ENGINEERING, 2008, 85 (08) : 1795 - 1803
  • [5] Harman G.G., 1997, WIRE BONDING MICROEL
  • [6] DEFORMATION AND BONDING PROCESSES IN ALUMINUM ULTRASONIC WIRE WEDGE BONDING
    KRZANOWSKI, JE
    MURDESHWAR, N
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 1990, 19 (09) : 919 - 928
  • [7] A TRANSMISSION ELECTRON-MICROSCOPY STUDY OF ULTRASONIC WIRE BONDING
    KRZANOWSKI, JE
    [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1990, 13 (01): : 176 - 181
  • [8] EFFECTS OF ULTRASOUND ON DEFORMATION CHARACTERISTICS OF METALS
    LANGENECKER, B
    [J]. IEEE TRANSACTIONS ON SONICS AND ULTRASONICS, 1966, SU13 (01): : 1 - +
  • [9] LUM I, J ELECTRON MAT UNPUB
  • [10] A microstructural study of dislocation substructures formed in metal foil substrates during ultrasonic wire bonding
    Murdeshwar, N
    Krzanowski, JE
    [J]. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1997, 28 (12): : 2663 - 2671
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