Atomic layer deposition of Al2O3 and Al2O3/TiO2 barrier coatings to reduce the water vapour permeability of polyetheretherketone

被引：28

作者：

Ahmadzada, Tamkin ^{[1
]}

McKenzie, David R. ^{[2
]}

James, Natalie L. ^{[2
]}

Yin, Yongbai ^{[2
]}

Li, Qing ^{[1
]}

机构：

[1] Univ Sydney, Sch Aerosp Mech & Mechatron Engn, Sydney, NSW 2006, Australia

[2] Univ Sydney, Sch Phys, Sydney, NSW 2006, Australia

来源：

THIN SOLID FILMS | 2015年 / 591卷

基金：

澳大利亚研究理事会;

关键词：

Polyetheretherketone; Water vapour permeability; Atomic layer deposition; Thin film coating; GAS-DIFFUSION BARRIERS; PACKAGING MATERIALS; AMORPHOUS-CARBON; HARD COATINGS; POLYMERS; MULTILAYER; FRACTURE; TOUGHNESS; GROWTH; FILMS;

D O I：

10.1016/j.tsf.2015.08.038

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Wedemonstrate significantly enhanced barrier properties of polyetheretherketone (PEEK) against water vapour penetration by depositing Al2O3 or Al2O3/TiO2 nanofilms grown by atomic layer deposition (ALD). Nanoindentation analysis revealed good adhesion strength of a bilayer Al2O3/TiO2 coating to PEEK, while the single layer Al2O3 coating displayed flaking and delamination. We identified three critical design parameters for achieving the optimum barrier properties of ALDAl(2)O(3)/TiO2 coatings on PEEK. These are a minimum total thickness dependent on the required water vapour transmission rate, the use of an Al2O3/TiO2 bilayer coating and the application of the coating to both sides of the PEEK film. Using these design parameters, we achieved a reduction in moisture permeability of PEEK of over two orders of magnitude while maintaining good adhesion strength of the polymer-thin film system. (C) 2015 Elsevier B.V. All rights reserved.

引用

页码：131 / 136

页数：6

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