Atomic layer deposition of Al2O3 and Al2O3/TiO2 barrier coatings to reduce the water vapour permeability of polyetheretherketone

被引:28
|
作者
Ahmadzada, Tamkin [1 ]
McKenzie, David R. [2 ]
James, Natalie L. [2 ]
Yin, Yongbai [2 ]
Li, Qing [1 ]
机构
[1] Univ Sydney, Sch Aerosp Mech & Mechatron Engn, Sydney, NSW 2006, Australia
[2] Univ Sydney, Sch Phys, Sydney, NSW 2006, Australia
基金
澳大利亚研究理事会;
关键词
Polyetheretherketone; Water vapour permeability; Atomic layer deposition; Thin film coating; GAS-DIFFUSION BARRIERS; PACKAGING MATERIALS; AMORPHOUS-CARBON; HARD COATINGS; POLYMERS; MULTILAYER; FRACTURE; TOUGHNESS; GROWTH; FILMS;
D O I
10.1016/j.tsf.2015.08.038
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Wedemonstrate significantly enhanced barrier properties of polyetheretherketone (PEEK) against water vapour penetration by depositing Al2O3 or Al2O3/TiO2 nanofilms grown by atomic layer deposition (ALD). Nanoindentation analysis revealed good adhesion strength of a bilayer Al2O3/TiO2 coating to PEEK, while the single layer Al2O3 coating displayed flaking and delamination. We identified three critical design parameters for achieving the optimum barrier properties of ALDAl(2)O(3)/TiO2 coatings on PEEK. These are a minimum total thickness dependent on the required water vapour transmission rate, the use of an Al2O3/TiO2 bilayer coating and the application of the coating to both sides of the PEEK film. Using these design parameters, we achieved a reduction in moisture permeability of PEEK of over two orders of magnitude while maintaining good adhesion strength of the polymer-thin film system. (C) 2015 Elsevier B.V. All rights reserved.
引用
收藏
页码:131 / 136
页数:6
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