Electrochemically deposited and etched membranes with precisely sized micropores for biological fluids microfiltration

被引:19
作者
Hamzah, A. A. [1 ]
Abidin, H. E. Zainal [1 ]
Majlis, B. Yeop [1 ]
Nor, M. Mohd [1 ]
Ismardi, A. [1 ]
Sugandi, G. [1 ]
Tiong, T. Y. [1 ]
Dee, C. F. [1 ]
Yunas, J. [1 ]
机构
[1] Univ Kebangsaan Malaysia, Inst Microengn & Nanoelect IMEN, Bangi 43600, Malaysia
关键词
POROUS SILICON; FABRICATION; KINETICS;
D O I
10.1088/0960-1317/23/7/074007
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents simple and economical, yet reliable techniques to fabricate a micro-fluidic filter for MEMS lab-on-chip (LoC) applications. The microporous filter is a crucial component in a MEMS LoC system. Microsized components and contaminants in biological fluids are selectively filtered using copper and silicon membranes with precisely controlled microsized pores. Two techniques were explored in microporous membrane fabrication, namely copper electroplating and electrochemical etching (ECE) of silicon. In the first technique, a copper membrane with evenly distributed micropores was fabricated by electroplating the copper layer on the silicon nitride membrane, which was later removed to leave the freestanding microporous membrane structure. The second approach involves the thinning of bulk silicon down to a few micrometers thick using KOH and etching the resulting silicon membrane in 5% HF by ECE to create micropores. Upon testing with nanoparticles of various sizes, it was observed that electroplated copper membrane passes nanoparticles up to 200 nm wide, while porous silicon membrane passes nanoparticles up to 380 nm in size. Due to process compatibility, simplicity, and low-cost fabrication, electroplated copper and porous silicon membranes enable synchronized microfilter fabrication and integration into the MEMS LoC system.
引用
收藏
页数:9
相关论文
共 31 条
[1]   Low Temperature Copper-Copper Thermocompression Bonding [J].
Ang, X. F. ;
Lin, A. T. ;
Wei, J. ;
Chen, Z. ;
Wong, C. C. .
EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, :399-+
[2]   Kinetics of electrochemical corrosion of silicon wafers in dilute HF solutions [J].
Bertagna, V ;
Plougonven, C ;
Rouelle, F ;
Chemla, M .
JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 1997, 422 (1-2) :115-123
[3]   Protein length in eukaryotic and prokaryotic proteomes [J].
Brocchieri, L ;
Karlin, S .
NUCLEIC ACIDS RESEARCH, 2005, 33 (10) :3390-3400
[4]  
Crittenden J.C., 2005, Water treatment principles and design
[5]   Fabrication and optimization of porous silicon substrates for diffusion membrane applications [J].
Cruz, S ;
Hönig-dOrville, A ;
Müller, J .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2005, 152 (06) :C418-C424
[6]  
Dini J.W., 2010, MODERN ELECTROPLATIN, V5th
[7]   FORMATION MECHANISM OF POROUS SILICON LAYERS OBTAINED BY ANODIZATION OF MONOCRYSTALLINE N-TYPE SILICON IN HF SOLUTIONS [J].
DUBIN, VM .
SURFACE SCIENCE, 1992, 274 (01) :82-92
[8]   High-performance silicon nanopore hemofiltration membranes [J].
Fissell, William H. ;
Dubnisheva, Anna ;
Eldridge, Abigail N. ;
Fleischman, Aaron J. ;
Zydney, Andrew L. ;
Roy, Shuvo .
JOURNAL OF MEMBRANE SCIENCE, 2009, 326 (01) :58-63
[9]  
Flott L.W., 1996, Metal Finishing, V94, P55
[10]   Sputtered Encapsulation as Wafer Level Packaging for Isolatable MEMS Devices: A Technique Demonstrated on a Capacitive Accelerometer [J].
Hamzah, Azrul Azlan ;
Yunas, Jumril ;
Majlis, Burhanuddin Yeop ;
Ahmad, Ibrahim .
SENSORS, 2008, 8 (11) :7438-7452