Effect of cooling structure on thermal behavior of copper plates of slab continuous casting mold

被引：10
作者：
Meng Xiang-ning [1 ]
Zhu Miao-yong [1 ]
机构：
[1] Northeastern Univ, Sch Met & Mat, Shenyang 110819, Peoples R China
来源：
JOURNAL OF CENTRAL SOUTH UNIVERSITY | 2013年 / 20卷 / 02期
基金：
中国国家自然科学基金;
关键词：
slab continuous casting; mold; copper plate; cooling structure; thermal behavior; finite element analysis; MECHANICAL-BEHAVIOR; HEAT-TRANSFER; STEEL SOLIDIFICATION; FLUX; SPEED; CRACK; MODEL;
D O I：
10.1007/s11771-013-1490-2
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
A three-dimensional finite-element model of slab continuous casting mold was conducted to clarify the effect of cooling structure on thermal behavior of copper plates. The results show that temperature distribution of hot surface is mainly governed by cooling structure and heat-transfer conditions. For hot surface centricity, maximum surface temperature promotions are 30 A degrees C and 15 A degrees C with thickness increments of copper plates of 5 mm and nickel layers of 1 mm, respectively. The surface temperature without nickel layers is depressed by 10 A degrees C when the depth increment of water slots is 2 mm and that with nickel layers adjacent to and away from mold outlet is depressed by 7 A degrees C and 5 A degrees C, respectively. The specific trend of temperature distribution of transverse sections of copper plates is nearly free of cooling structure, but temperature is changed and its law is similar to the corresponding surface temperature.
引用
收藏
页码：318 / 325
页数：8
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