Advanced packaging technologies used in NASA's 3D space Flight Computer

被引：0

作者：

Alkalai, L ^{[1
]}

机构：

[1] CALTECH, Jet Prop Lab, Ctr Integrated Space Microsyst, Pasadena, CA 91109 USA

来源：

1999 INTERNATIONAL CONFERENCE ON HIGH DENSITY PACKAGING AND MCMS, PROCEEDINGS | 1999年 / 3830卷

关键词：

3D packaging technologies; Flight Computer; avionics;

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

During 1995-1997, NASA's New Millennium Program developed the 3D Flight Computer technology for validation on its first Deep-Space 1 mission launched in October 1998. Whereas, the computer was not delivered on schedule for inclusion on the spacecraft, it was delivered, integrated and space qualified at JPL. This computer is characterized by the aggressive use of advanced packaging technologies: 3D chip stacking, multichip modules and 3D MCM stacking. This development represents an important technology milestone towards the further miniaturization of all spacecraft avionics into an integrated architecture.

引用

页码：85 / 90

页数：6