Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-free Solder Ball Joints

被引：1

作者：

Shohji, Ikuo ^{[1
]}

Shimoyama, Satoshi ^{[1
]}

Ishikawa, Hisao ^{[2
]}

Kojima, Masao ^{[3
]}

机构：

[1] Gunma Univ, Grad Sch Engn, Tenjin, Kiryu 3768515, Japan

[2] Nippon Joint Co Ltd, Mooka, Tochigi 321 4302, Japan

[3] KOJIMA SOLDER Co Ltd, Matsudo, Chiba 207 2241, Japan

来源：

ADVANCES IN FRACTURE AND DAMAGE MECHANICS VII | 2008年 / 385-387卷

关键词：

Sn-9mass%Zn; Sn-3mass%Ag-0.5mass%Cu; Impact properties; Fracture; Ball shear impact test; Lead-free solder;

D O I：

10.4028/www.scientific.net/KEM.385-387.429

中图分类号：

TU [建筑科学];

学科分类号：

0813 ;

摘要：

Impact properties of solder ball joints with Sn-9mass%Zn and Sn-3mass%Ag-0.5mass%Cu lead-free solders were investigated under aging at 423 K. In the case of the joints with Cu electrodes, both Sn-9Zn and Sn-Mg-MCu joints have similar impact forces before aging. For the Sn-3Ag-0.5Cu joint, fracture occurred in an intermetallic compound (IMC) layer formed in a joint interface regardless of aging, and thus the impact force was stable upon aging at 423 K for 500 h. For the Sn-9Zn joint, fracture mode changed from solder fracture to other fracture upon aging and thus this change led a decrease in the impact force. In the Sn-9Zn joint with an electroless Ni/Au plated electrode, fracture occurred in the solder regardless of aging, and thus impact properties improved compared with the joint using the Cu electrode. The impact properties are superior to those of the Sn-Mg-MCu joints with the Cu and the electroless Ni/Au electrodes.

引用

页码：429 / +

页数：2

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