On the origin of the stress decrease for nickel polycrystals with few grains across the thickness

被引:88
作者
Keller, C. [1 ]
Hug, E. [1 ]
Chateigner, D. [1 ]
机构
[1] Univ Caen, CNRS, ENSICAEN, Lab Cristallog & Sci Mat, F-14050 Caen 4, France
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2009年 / 500卷 / 1-2期
关键词
Nickel; Size effect; Grain size; Microstructure; Hall-Petch law; FOIL COPPER CRYSTALS; FLOW-STRESS; PLASTIC DEFORMATION; SIZE; SURFACE; BEHAVIOR; TENSILE; TEXTURE; STRAIN; SHEET;
D O I
10.1016/j.msea.2008.09.054
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The mechanical behaviour under uniaxial and loading/unloading tensile tests of high purity nickel with different number of grains across the thickness is studied experimentally. The specimens have a constant 500 mu m thickness and the mean number of grains across the thickness (i.e., thickness "t" to grain size "d" ratio) lies between 0.9 and 15. An extended microstructural study is operated and no change of the microstructure appears with a modification of t/d. The experimental results show that the t/d ratio affects the hardening stages, flow stress, intragranular and intergranular backstress of the samples. For specimens with few grains across the thickness, the flow stress is reduced due to a decrease in the intragranular backstress. The main explanation of these results is a delay of the generalization of cross-slip for the lowest t/d ratio specimens due to surface effects. (C) 2008 Elsevier B.V. All rights reserved.
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页码:207 / 215
页数:9
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