Impact crack propagation through the dual-phased (Cu,Ni)6Sn5 layer in Sn-Ag-Cu/Ni solder joints

被引：21

作者：

Fu, Shao-Wei ^{[1
]}

Yu, Chi-Yang ^{[1
]}

Lee, Tae-Kyu ^{[2
]}

Liu, Kuo-Chuan ^{[2
]}

Duh, Jenq-Gong ^{[1
]}

机构：

[1] Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan

[2] Cisco Syst Inc, Component Qual & Technol Grp, San Jose, CA USA

来源：

MATERIALS LETTERS | 2012年 / 80卷

关键词：

Electronic materials; Metallurgy; Microstructure; Interfaces; Indentation and hardness; RELIABILITY;

D O I：

10.1016/j.matlet.2012.04.099

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The interfacial reactions of the Sn-3Ag-0.75Cu/Au/Ni solder joint before and after aging were investigated. The dual-phased (Cu,Ni)(6)Sn-5 with high (20.6 at.%) and low Ni (5.7 at.%) contents formed at the Sn-Ag-Cu/Ni interface, represented as H-(Cu,Ni)(6)Sn-5 and L-(Cu,Ni)(6)Sn-5. respectively. By employing high-speed impact test, the impact fracture morphology reveals that the H-(Cu,Ni)(6)Sn-5/L-(Cu,Ni)(6)Sn-5 interface facilitates the crack nucleation within the intermetallic compound (IMC). The indentation data shows that bulk H-(Cu, Ni)6Sn5 exhibits distinctly higher hardness and lower fracture toughness than bull: L-(Cu,Ni)(6)Sn-5. In correlating the impact fracture behavior and mechanical properties of H-(Cu,Ni)(6)Sn-5 and L-(Cu,Ni)(6)Sn-5, cracks tend to propagate through the H-(Cu,Ni)(6)Sn-5 IMC due to the relatively low fracture toughness of H-(Cu,Ni)(6)Sn-5. In addition, mechanisms for the formation of the dual-phased (Cu,Ni)(6)Sn-5 IMC are discussed in details. Crown Copyright (C) 2012 Published by Elsevier B.V. All rights reserved.

引用

页码：103 / 105

页数：3

共 11 条

[1] Mechanical properties evolution of Sn-3.5Ag based lead-free solders by nanoindentation [J].

Gao, F. ;

Takemoto, T. .

MATERIALS LETTERS, 2006, 60 (19) :2315-2318

[2] Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni [J].

Ho, CE ;

Tsai, RY ;

Lin, YL ;

Kao, CR .

JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (06) :584-590

[3] Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders [J].

Kang, Sung K. ;

Cho, Moon Gi ;

Shih, Da-Yuan ;

Seo, Sun-Kyoung ;

Lee, Hyuck Mo .

58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, :478-+

[4] Effect of Cu content on the mechanical reliability of Ni/Sn-3.5Ag system [J].

Kim, J. Y. ;

Sohn, Y. C. ;

Yu, Jin .

JOURNAL OF MATERIALS RESEARCH, 2007, 22 (03) :770-776

[5] Analysis of high speed shear characteristics of Sn-Ag-Cu solder joints [J].

Kumar, Santosh ;

Park, Jae Yong ;

Jung, Jae Pil .

ELECTRONIC MATERIALS LETTERS, 2011, 7 (04) :365-373

[6] The influence of Ni additions on the relative stability of η and η' Cu6Sn5 [J].

Schwingenschloegl, U. ;

Di Paola, C. ;

Nogita, K. ;

Gourlay, C. M. .

APPLIED PHYSICS LETTERS, 2010, 96 (06)

[7] Interfacial reaction and shear strength of SnAgCu-xNi/Ni solder joints during aging at 150 °C [J].

Yao, Pei ;

Liu, Ping ;

Liu, Jim .

MICROELECTRONIC ENGINEERING, 2009, 86 (10) :1969-1974

[8] Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni Sandwich Structures [J].

Yu, Chi-Yang ;

Lee, Tae-Kyu ;

Tsai, Michael ;

Liu, Kuo-Chuan ;

Duh, Jenq-Gong .

JOURNAL OF ELECTRONIC MATERIALS, 2010, 39 (12) :2544-2552

[9] First-principles investigation of the structural and electronic properties of Cu6-xNixSn5 (x=0, 1, 2) intermetallic compounds [J].

Yu, Chun ;

Liu, Junyan ;

Lu, Hao ;

Li, Peilin ;

Chen, Junmei .

INTERMETALLICS, 2007, 15 (11) :1471-1478

[10] Six cases of reliability study of Pb-free solder joints in electronic packaging technology [J].

Zeng, K ;

Tu, KN .

MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2002, 38 (02) :55-105

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