The influence of liquid environment of the strength of polymer-solid interface

被引:0
|
作者
Gorbatkina, YA
IvanovaMumzhieva, VG
Puchkov, LV
Sulyaeva, ZP
机构
关键词
D O I
暂无
中图分类号
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号
07 ; 0710 ; 09 ;
摘要
引用
收藏
页码:486 / 488
页数:3
相关论文
共 50 条
  • [1] Polymer-solid interfaces: Influence of sticker groups on structure and strength
    Gong, LZ
    Friend, AD
    Wool, RP
    MACROMOLECULES, 1998, 31 (11) : 3706 - 3714
  • [2] Surface order and structure studies of polymer-solid interface
    Jain, SC
    Tanwar, VK
    Dixit, V
    Verma, SP
    Samanta, SB
    APPLIED SURFACE SCIENCE, 2001, 182 (3-4) : 350 - 356
  • [3] Adhesion at polymer-solid interfaces: Influence of sticker groups on structure, chain connectivity and strength
    Gong, LZ
    Wool, RP
    JOURNAL OF ADHESION, 1999, 71 (2-3): : 189 - 209
  • [4] Measuring polymer dynamics near the polymer-solid interface with neutron reflectometry.
    Lin, EK
    Wu, WL
    Satija, SK
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1997, 214 : 39 - MACR
  • [5] POLYMER-SOLID INTERACTIONS
    KUMINS, CA
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1975, 170 (AUG24): : 1 - 1
  • [6] POLYMER-SOLID ADHESION - EXPERIMENTS AND RECENT MODELS
    LEGER, L
    VIDE-SCIENCE TECHNIQUE ET APPLICATIONS, 1993, 49 (268): : 295 - 302
  • [7] Friction mechanisms at polymer-solid interfaces
    Léger, L
    Hervet, H
    Bureau, L
    COMPTES RENDUS CHIMIE, 2006, 9 (01) : 80 - 89
  • [8] Influence of the ionic strength on the structure of polyelectrolyte films at the solid/liquid interface
    Steitz, R
    Leiner, V
    Siebrecht, R
    von Klitzing, R
    COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS, 2000, 163 (01) : 63 - 70
  • [9] Hierarchical simulations of hybrid polymer-solid materials
    Johnston, Karen
    Harmandaris, Vagelis
    SOFT MATTER, 2013, 9 (29) : 6696 - 6710
  • [10] POLYMER-SOLID ADHESION - EXPERIENCES AND RECENT MODELS
    LEGER, L
    VIDE-SCIENCE TECHNIQUE ET APPLICATIONS, 1993, (268): : 92 - 99