Distributed On-Chip Power Delivery

被引:41
作者
Koese, Selcuk [1 ]
Friedman, Eby G. [2 ]
机构
[1] Univ S Florida, Dept Elect Engn, Tampa, FL 33620 USA
[2] Univ Rochester, Dept Elect & Comp Engn, Rochester, NY 14627 USA
基金
美国国家科学基金会;
关键词
Distributed power delivery; heterogeneous integrated circuit (IC); on-chip decoupling capacitor; point-of-load power supply; DECOUPLING CAPACITORS; REGULATOR;
D O I
10.1109/JETCAS.2012.2226378
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The performance of an integrated circuit depends strongly upon the power delivery system. With the introduction of ultra-small on-chip voltage regulators, novel design methodologies are needed to simultaneously determine the location of the on-chip power supplies and decoupling capacitors. In this paper, a unified design methodology is proposed to determine the optimal location of the power supplies and decoupling capacitors in high performance integrated circuits. Optimization algorithms widely used for facility location problems are applied in the proposed methodology. The effect of the number and location of the power supplies and decoupling capacitors on the power noise and response time is discussed.
引用
收藏
页码:704 / 713
页数:10
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