Transport mechanism of interfacial network forming atoms during silicon oxidation

被引:16
作者
Kageshima, H
Uematsu, M
Akagi, K
Tsuneyuki, S
Akiyama, T
Shiraishi, K
机构
[1] Nippon Telegraph & Tel Corp, Basic Res Labs, Atsugi, Kanagawa 2430198, Japan
[2] Univ Tokyo, Grad Sch Sci, Tokyo 1130033, Japan
[3] Mie Univ, Dept Engn Phys, Tsu, Mie 5148507, Japan
[4] Univ Tsukuba, Grad Sch Pure & Appl Sci, Tsukuba, Ibaraki 3058571, Japan
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS | 2006年 / 45卷 / 2A期
关键词
Si; Si oxide; interface; oxidation; defects; transformation; first-principles calculation;
D O I
10.1143/JJAP.45.694
中图分类号
O59 [应用物理学];
学科分类号
摘要
A first-principles study on the energetics of the structural transformation a, the interface, revealed that oxygen vacancies can accompany the high density oxide regions formed during the silicon oxidation. The vacancies can also promote the effective out-migration of these regions, which allows the easier oxide viscous flow to release the interfacial strain. Compared with this mechanism, self-interstitials are rarely formed in the silicon substrate. These results also suggest defect formation mechanisms around the interfaces.
引用
收藏
页码:694 / 699
页数:6
相关论文
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