Biaxial stress measurement by electrodeposited copper foil with circular holes

被引：5

作者：

Kitaoka, S ^{[1
]}

Ono, Y ^{[1
]}

机构：

[1] Tottori Univ, Fac Engn, Tottori 6808552, Japan

来源：

STRAIN | 2006年 / 42卷 / 01期

关键词：

D O I：

10.1111/j.1475-1305.2006.00249.x

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The possibility of a biaxial stress measurement method using the grain growth region at the periphery of circular holes was examined. Cyclic loading tests were carried out under various biaxial stress ratios using electrodeposited copper foil adhered to titanium alloy specimens with circular holes, and the grain growth region at the periphery of a circular hole investigated. The density of grains grown at locations away from the holes was also measured to establish expressions that determine the principal stress amplitudes. To verify the validity of the expressions, stress values obtained were compared with those from strain gauge rosettes.

引用

页码：49 / 56

页数：8

共 12 条

[1] STRESS MEASUREMENT BY COPPER ELECTROPLATING AIDED BY A PERSONAL-COMPUTER [J].