Thermomechanical properties of amorphous metallic tungsten-oxygen and tungsten-oxide coatings

被引:31
作者
Besozzi, E. [1 ]
Dellasega, D. [1 ,2 ]
Russo, V. [1 ]
Conti, C. [3 ]
Passoni, M. [1 ,2 ]
Beghi, M. G. [1 ]
机构
[1] Politecn Milan, Dipartimento Energia, Via Ponzio 34-3, I-20133 Milan, Italy
[2] CNR, IFP, ENEA, Assoc EURATOM, Via R Cozzi 53, I-20125 Milan, Italy
[3] CNR, ICVBC, Via Cozzi 54, I-20125 Milan, Italy
基金
欧洲研究理事会;
关键词
Tungsten oxide coatings; Thermomechanical properties; Residual stresses; Thermal expansion coefficient; Thermal stability; PULSED-LASER DEPOSITION; THIN-FILMS; MECHANICAL CHARACTERIZATION; THERMAL-EXPANSION; SMART WINDOWS; WO3; DEVICES;
D O I
10.1016/j.matdes.2018.107565
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Metallic amorphous tungsten-oxygen and amorphous tungsten-oxide films, deposited by Pulsed Laser Deposition, are characterized. The correlation is investigated between morphology, composition, and structure, measured by various techniques, and the mechanical properties, characterized by Brillouin Spectroscopy and the substrate curvature method. The stiffness of the films is correlated to the oxygen content and the mass density. The elastic moduli decrease as the mass density decreases and the oxygen-tungsten ratio increases. A plateau region is observed around the transition between the metal-like (conductive and opaque) films and the oxide ones (non-conductive and transparent). The compressive residual stresses, moderate stiffness and high local ductility of compact amorphous tungsten-oxide films are interesting for applications involving thermal or mechanical loads. The coefficient of thermal expansion is quite high (8.9 . 10(-6) K-1), being strictly correlated to the amorphous structure and stoichiometry of the films. Upon thermal treatments the coatings show a quite low relaxation temperature of 450 K. Starting from 670 K, they crystallize into the gamma monoclinic phase of WO3, the stiffness increasing by about 70%. The measured thermomechanical properties provide a guidance for the design of devices which include a tungsten based layer, in order to assure their mechanical integrity. (C) 2019 The Authors. Published by Elsevier Ltd.
引用
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页数:11
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