Heat Transfer Enhancement in Oblique Finned Channel

被引:6
作者
Tiwary, Badyanath [1 ]
Kumar, Ritesh [1 ]
Singh, Pawan Kumar [1 ]
机构
[1] Indian Inst Technol ISM, Dept Mech Engn, Dhanbad 826004, Jharkhand, India
来源
ADVANCES IN FLUID AND THERMAL ENGINEERING | 2019年
关键词
Nanofluid; Enhanced microchannel; Oblique fin; DPM; THERMAL-CONDUCTIVITY; SINK;
D O I
10.1007/978-981-13-6416-7_15
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
In the modernistic day, cooling is one of the predominant challenges of electronic and automobile industry. The demand for faster and smaller devices increases the thermal load, and at the same time, conventional cooling techniques that use extended surfaces (fins, microchannel, heat sink, heat pipe, etc.) reached their limits. Recently, oblique fin heat sink has been found as an alternative to conventional heat sink because of their improved heat transfer performance and a marginal increase in pressure drop. The reason behind this improved heat transfer is the breakage of the continuous fin into oblique fin which keeps the flow in developing condition. Also, the secondary flow through oblique channel diverts a small fraction of flow and enhances mixing. The present paper tries to capitalize the advantage of the oblique fin with the benefits of nanofluid by carrying out a detailed numerical simulation. Alumina-water nanofluid has been used for numerical analysis using single-phase and discrete phase modeling approaches through oblique fin microchannel. Conjugate heat transfer between the oblique fin heat sink and nanofluid is computed numerically. Approximately, 115 and 145% heat transfer enhancement has been observed in oblique channel compared to rectangular microchannel in single-phase modeling and discrete phase modeling, respectively.
引用
收藏
页码:157 / 167
页数:11
相关论文
共 12 条
  • [1] Buongiorno J, 2016, J HEAT TRANSF, V128, P240
  • [2] Choi SU, 2016, ANLMSDCP84938
  • [3] Fluent ANSYS, 2016, FLUENT 15 USERS GUID
  • [4] Numerical study on layout of micro-channel heat sink for thermal management of electronic devices
    Gong, Liang
    Zhao, Jin
    Huang, Shanbo
    [J]. APPLIED THERMAL ENGINEERING, 2015, 88 : 480 - 490
  • [5] Goutam S, 2014, INT C ADV CIV STRUCT
  • [6] THERMAL CONDUCTIVITY OF HETEROGENEOUS 2-COMPONENT SYSTEMS
    HAMILTON, RL
    CROSSER, OK
    [J]. INDUSTRIAL & ENGINEERING CHEMISTRY FUNDAMENTALS, 1962, 1 (03): : 187 - &
  • [7] Towards Ultra-Compact High Heat Flux Microchannel Heat Sink
    Khan, Jamil A.
    Morshed, A. K. M. M. Monjur
    Fang, Ruixian
    [J]. 10TH INTERNATIONAL CONFERENCE ON MECHANICAL ENGINEERING (ICME 2013), 2014, 90 : 11 - 24
  • [8] Lee YJ, 2009, INT C EN SUST P 2009
  • [9] Fluid flow and heat transfer investigations on enhanced microchannel heat sink using oblique fins with parametric study
    Lee, Yong Jiun
    Singh, Pawan K.
    Lee, Poh Seng
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2015, 81 : 325 - 336
  • [10] EXPERIMENTAL INVESTIGATION OF HEAT-TRANSFER IN FLAT PLATES WITH RECTANGULAR MICROCHANNELS
    PENG, XF
    WANG, BX
    PETERSON, GP
    MA, HB
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 1995, 38 (01) : 127 - 137