Bulk charge-transfer doping of amorphous metal oxide: fullerene blends for solution-processed amorphous indium zinc oxide thin-film transistors

被引:13
|
作者
Le, Minh Nhut [1 ]
Kim, Hyeongyeon [2 ]
Kang, Yeo Kyung [1 ]
Song, Youngmin [3 ]
Guo, Xugang [4 ]
Ha, Young-Geun [3 ]
Kim, Choongik [2 ]
Kim, Myung-Gil [1 ]
机构
[1] Chung Ang Univ, Dept Chem, Seoul 06974, South Korea
[2] Sogang Univ, Dept Chem & Biomol Engn, Seoul 04107, South Korea
[3] Kyonggi Univ, Dept Chem, Suwon 16227, Gyeonggi Do, South Korea
[4] Southern Univ Sci & Technol, Dept Mat Sci & Engn, Shenzhen Key Lab Printed Organ Elect, Shenzhen 518055, Guangdong, Peoples R China
关键词
LOW-TEMPERATURE; HIGH-PERFORMANCE; CHALCOGENIDE GLASSES; ACTIVE-LAYER; IGZO TFT; FABRICATION; MALONATE; DRIVE; ACID;
D O I
10.1039/c9tc01801h
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The successful implementation of amorphous In-Ga-Zn-O with a mobility >10 cm(2) V-1 s(-1) in the electronic industry indicates the significant potential of the amorphous oxide semiconductor (AOS) materials in the next-generation optoelectronics. However, the low-cost, large-area solution processes for AOS materials require high annealing temperatures (>400 degrees C), which is not favorable for flexible substrate application. Moreover, the lack of a doping method for AOS materials possessing an amorphous disorder structure further limits its application. In this study, a fullerene derivative (C60-malonic acid) was employed as the bulk charge-transfer dopant in solution-processed amorphous indium-zinc oxide (a-IZO) thin-film transistors. With the facile bulk charge-transfer doping from a mixed precursor solution, high-performance thin-film transistors were realized at a low annealing temperature of 250 degrees C. At an optimized doping concentration, the carrier mobility increased from 1.21 cm(2) V-1 s(-1) for an undoped a-IZO film to 2.42 cm(2) V-1 s(-1) for a doped a-IZO one. Furthermore, optimized doping enhanced the device stability under the bias stress condition. Therefore, the threshold voltage (V-th) shift during the positive bias stress condition (V-G = 50 V; V-DS = 25 V) for 1000 s drastically reduced from 28.9 V for an undoped device to 16.0 V for a device with optimized doping (1%).
引用
收藏
页码:10635 / 10641
页数:7
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