Magnetic Alignment of Hexagonal Boron Nitride Platelets in Polymer Matrix: Toward High Performance Anisotropic Polymer Composites for Electronic Encapsulation

被引:434
作者
Lin, Ziyin [1 ]
Liu, Yan [1 ]
Raghavan, Sathyanarayanan [2 ]
Moon, Kyoung-sik [1 ]
Sitaraman, Suresh K. [1 ]
Wong, Ching-ping [1 ,3 ]
机构
[1] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA
[2] Georgia Inst Technol, Sch Mech Engn, Atlanta, GA 30332 USA
[3] Chinese Univ Hong Kong, Dept Elect Engn, Hong Kong, Hong Kong, Peoples R China
关键词
hexagonal boron nitride; polymer composite; magnetic alignment; thermal conductivity; coefficient of thermal expansion; THERMAL INTERFACE MATERIALS; ALIGNED CARBON NANOTUBE; CONDUCTIVITY; NANOCOMPOSITES; EXPANSION; NANOPARTICLES; FILMS; GENERATION; NANOWIRES; POLYIMIDE;
D O I
10.1021/am401939z
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
We report magnetic alignment of hexagonal boron nitride (hBN) platelets and the outstanding material properties of its polymer composite. The magnetically responsive hBN is produced by surface modification of iron oxide, and their orientations can be controlled by applying an external magnetic field during polymer curing. Owing to the anisotropic properties of hBN, the epoxy composite with aligned hBN platelets shows interesting properties along the alignment direction, including significantly reduced coefficient of thermal expansion, reaching similar to 28.7 ppm/degrees C, and enhanced thermal conductivity, 104% higher than that of unaligned counterpart, both of which are observed at a low filler loading of 20 wt %. Our modeling suggests the filler alignment is the major reason for these intriguing material properties. Finite element analysis reveals promising applications for the magnetically aligned hBN-based composites in modern microelectronic packaging.
引用
收藏
页码:7633 / 7640
页数:8
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