Effect of Cd2+ as a stabilizer in the electroless nickel plating system

被引：18

作者：

Xiao, Zongyuan ^{[1
]}

Wang, Wenjing ^{[1
]}

Ye, Liyi ^{[1
]}

Sha, Yong ^{[1
]}

Tu, Song ^{[1
]}

机构：

[1] Xiamen Univ, Coll Chem & Chem Engn, Dept Chem & Biochem Engn, Fujian 361005, Peoples R China

来源：

SURFACE & COATINGS TECHNOLOGY | 2008年 / 202卷 / 20期

基金：

中国国家自然科学基金;

关键词：

electroless nickel plating; stabilizer; plating rate; bath stability; corrosion resistance;

D O I：

10.1016/j.surfcoat.2008.05.002

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Bath decomposition is a major problem in the electroless nickel (EN) plating system. Although the stabilization mechanism is far from being fully understood, bath stabilizers are normally added to extend the bath life in a viable EN plating solution. In this study, the effects ofCd" as a stabilizer on the plating rate, bath stability, and phosphorus content, corrosion resistance and microstructure of the deposits were investigated. The deposited films were examined using a scanning electron microscope (SEM) equipped with energy dispersive X-ray (EDX) spectroscopy and the X-ray photo spectroscopy (XPS). The electronic tunneling mechanism was used to elucidate the effect of the Cd2+ stabilizer on the plating system theoretically. The results calculated from theoretical method agreed well with the experimental data. (c) 2008 Elsevier B.V. All rights reserved.

引用

页码：5008 / 5011

页数：4

共 31 条

[1] Electroless deposition of Ni-Cu-P, Ni-W-P and Ni-W-Cu-P alloys
Balaraju, JN
Rajam, KS
[J]. SURFACE & COATINGS TECHNOLOGY, 2005, 195 (2-3) : 154 - 161
[2] Effect of accelerators and stabilizers on the formation and characteristics of electroless Ni-P deposits
Baskaran, I.
Narayanan, T. S. N. Sankara
Stephen, A.
[J]. MATERIALS CHEMISTRY AND PHYSICS, 2006, 99 (01) : 117 - 126
[3] NICKEL PLATING ON STEEL BY CHEMICAL REDUCTION
BRENNER, A
RIDDELL, GE
[J]. JOURNAL OF RESEARCH OF THE NATIONAL BUREAU OF STANDARDS, 1946, 37 (01): : 31 - 34
[4] In situ soil treatments to reduce the phyto- and bioavailability of lead, zinc, and cadmium
Brown, S
Chaney, R
Hallfrisch, J
Ryan, JA
Berti, WR
[J]. JOURNAL OF ENVIRONMENTAL QUALITY, 2004, 33 (02) : 522 - 531
[5] Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system:: A stabilizer or a codeposit?
Chen, Chun-Han
Chen, Bing-Hung
Hong, L.
[J]. CHEMISTRY OF MATERIALS, 2006, 18 (13) : 2959 - 2968
[6] The effects of stabilizers on the bath stability of electroless Ni deposition and the deposit
Cheong, WJ
Luan, BL
Shoesmith, DW
[J]. APPLIED SURFACE SCIENCE, 2004, 229 (1-4) : 282 - 300
[7] Das L, 1996, PLAT SURF FINISH, V83, P55
[8] De Minjer C.H., 1957, PLATING, V44, P1297
[9] CORROSION BEHAVIOR OF ELECTROLESS NICKEL-PLATING MODIFIED TIN COATING
DOONG, JC
DUH, JG
TSAI, SY
WANG, JH
CHIOU, BS
[J]. SURFACE & COATINGS TECHNOLOGY, 1993, 58 (03) : 157 - 161
[10] Interactions between cadmium uptake and phytotoxic levels of zinc in hard red spring wheat
Green, CE
Chaney, RL
Bouwkamp, J
[J]. JOURNAL OF PLANT NUTRITION, 2003, 26 (02) : 417 - 430

← 1 2 3 4 →